Issued Patents All Time
Showing 51–60 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5670019 | Removal process for tungsten etchback precipitates | — | 1997-09-23 |
| 5671119 | Process for cleaning an electrostatic chuck of a plasma etching apparatus | Shzh-Kuei Yen | 1997-09-23 |
| 5668038 | One step smooth cylinder surface formation process in stacked cylindrical DRAM products | Chen-Jong Wang, Mong-Song Liang | 1997-09-16 |
| 5641382 | Method to remove residue of metal etch | Tsu Shih, Chih-Chien Hung | 1997-06-24 |
| 5639345 | Two step etch back process having a convex and concave etch profile for improved etch uniformity across a substrate | Yu Chen-Hua Douglas | 1997-06-17 |
| 5631197 | Sacrificial etchback layer for improved spin-on-glass planarization | Chen-Hua Yu, Syun-Ming Jang, Lung Chen | 1997-05-20 |
| 5554254 | Post contact layer etch back process which prevents precipitate formation | Kuang-Hui Chang | 1996-09-10 |
| 5554563 | In situ hot bake treatment that prevents precipitate formation after a contact layer etch back step | Po-Tao Chu, Kuang-Hui Chang | 1996-09-10 |
| 5552346 | Planarization and etch back process for semiconductor layers | Chin-Kun Wang | 1996-09-03 |
| 5527736 | Dimple-free tungsten etching back process | Huang-Hui Chang | 1996-06-18 |