Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9876083 | Semiconductor devices, FinFET devices and methods of forming the same | Liang-Chen Chi, Chia-Ming Tsai, Wei Wang, Miin-Jang Chen | 2018-01-23 |
| 9595593 | Semiconductor structure with interfacial layer and method for manufacturing the same | Wei-Fan Lee, Chee-Wee Liu, Yuh-Ta Fan, Chih-Hsiung Huang, Tzu-Yao Lin | 2017-03-14 |
| 9583393 | Epitaxial growth of doped film for source and drain regions | Chun Hsiung Tsai, Jian-An Ke, Tsan-Yao Chen | 2017-02-28 |
| 9362175 | Epitaxial growth of doped film for source and drain regions | Chun Hsiung Tsai, Jian-An Ke, Tsan-Yao Chen | 2016-06-07 |
| 9312138 | Method for forming gate dielectric layer | Liang-Chen Chi, Chia-Ming Tsai, Jhih-Jie Huang, Miin-Jang Chen | 2016-04-12 |
| 9306024 | Method of forming semiconductor device | Liang-Chen Chi, Chia-Ming Tsai, Jhih-Jie Huang, Miin-Jang Chen | 2016-04-05 |
| 9196718 | In-situ nitridation of gate dielectric for semiconductor devices | Liang-Chen Chi, Chia-Ming Tsai, Yu-Min Chang, Miin-Jang Chen, Li-Tien Huang | 2015-11-24 |
| 9064865 | Mechanisms for forming gate dielectric layer | Liang-Chen Chi, Chia-Ming Tsai, Jhih-Jie Huang, Miin-Jang Chen | 2015-06-23 |
| 8946036 | Method of forming dielectric films using a plurality of oxidation gases | Liang-Chen Chi, Chia-Ming Tsai, Yu-Min Chang, Miin-Jang Cheng, Keng-Ham Lin | 2015-02-03 |
| 8877592 | Epitaxial growth of doped film for source and drain regions | Chun Hsiung Tsai, Jian-An Ke, Tsan-Yao Chen | 2014-11-04 |
| 8729645 | Substrate backside peeling control | Liang-Chen Chi, Wei-Lun Jian, Chia-Ming Tsai, Yu-Min Chang | 2014-05-20 |
| 8041440 | Method and system for providing a selection of golden tools for better defect density and product yield | Chang Yung Cheng, Hsueh-Shih Fu, Ying-Lang Wang | 2011-10-18 |
| 5849637 | Integration of spin-on gap filling dielectric with W-plug without outgassing | — | 1998-12-15 |
| 5792705 | Optimized planarization process for SOG filled vias | Yuan-Chang Huang, Iman Hsu | 1998-08-11 |
| 5728631 | Method for forming a low capacitance dielectric layer | — | 1998-03-17 |
| 5723380 | Method of approach to improve metal lithography and via-plug integration | Lu Liu | 1998-03-03 |
| 5679606 | method of forming inter-metal-dielectric structure | Chen-Hua Yu, Lu-Min Lin | 1997-10-21 |
| 5567658 | Method for minimizing peeling at the surface of spin-on glasses | Cheng-Cheng Chang | 1996-10-22 |
| 5552346 | Planarization and etch back process for semiconductor layers | Yuan-Chang Huang | 1996-09-03 |