Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5840624 | Reduction of via over etching for borderless contacts | Syun-Ming Jang | 1998-11-24 |
| 5639345 | Two step etch back process having a convex and concave etch profile for improved etch uniformity across a substrate | Yuan-Chang Huang | 1997-06-17 |
| 5622894 | Process to minimize a seam in tungsten filled contact holes | Syun-Ming Jang | 1997-04-22 |