Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6261843 | Test pattern for monitoring metal corrosion on integrated circuit wafers | Chao-Hsin Chang, Hsien-Wen Chang, Chih-Chien Hung | 2001-07-17 |
| 5874309 | Method for monitoring metal corrosion on integrated circuit wafers | Chao-Hsin Chang, Hsien-Wen Chang, Chih-Chien Hung | 1999-02-23 |
| 5746928 | Process for cleaning an electrostatic chuck of a plasma etching apparatus | Shih-Kuei Yen, Po-Tao Chu | 1998-05-05 |
| 5672543 | Volcano defect-free tungsten plug | Chaur Rong Chang, Po-Tao Chu, Tzu-Min Peng | 1997-09-30 |
| 5554254 | Post contact layer etch back process which prevents precipitate formation | Yuan-Chang Huang | 1996-09-10 |
| 5554563 | In situ hot bake treatment that prevents precipitate formation after a contact layer etch back step | Po-Tao Chu, Yuan-Chang Huang | 1996-09-10 |