Issued Patents All Time
Showing 26–50 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127631 | Semiconductor device with contact structures | Yi-Hsun Chiu, Shang-Wen Chang | 2021-09-21 |
| 11081403 | Methods of forming contact features in field-effect transistors | Yi-Hsun Chiu, Shang-Wen Chang | 2021-08-03 |
| 11063041 | Integrated circuit device including a power supply line and method of forming the same | Shang-Wen Chang, Yi-Hsun Chiu | 2021-07-13 |
| 11004738 | Capacitance reduction by metal cut design | Yu-Xuan Huang, Chih-Ming Lai, Ru-Gun Liu, Shang-Wen Chang, Yi-Hsun Chiu | 2021-05-11 |
| 11004855 | Buried metal track and methods forming same | Pochun Wang, Ting-Wei Chiang, Chih-Ming Lai, Hui-Zhong Zhuang, Jung-Chan Yang +6 more | 2021-05-11 |
| 10946021 | Methods of treating or alleviating joint diseases by administering an inhibitor of discoidin domain receptor 1 (DDR1) | Chau-Zen Wang, Chung-Hwan Chen, Liang-Yin Chou, Yu-Cheng Chou, Mei-Ling Ho | 2021-03-16 |
| 10879176 | Integrated circuit structure | Shang-Wen Chang, Yi-Hsun Chiu | 2020-12-29 |
| 10818473 | Implanter calibration | Cheng-En Lee, Chia-Lin Ou, Hsuan-Pang Liu, Yao-Jen Yeh | 2020-10-27 |
| 10763198 | Monolithic 3D integration inter-tier vias insertion scheme and associated layout structure | Ta-Pen Guo, Carlos H. Diaz, Jean-Pierre Colinge | 2020-09-01 |
| 10763365 | Metal rail conductors for non-planar semiconductor devices | Chih-Liang Chen, Chih-Ming Lai, Ching-Wei Tsai, Charles Chew-Yuen Young, Jiann-Tyng Tzeng +5 more | 2020-09-01 |
| 10734321 | Integrated circuit and method of manufacturing same | Pochun Wang, Ting-Wei Chiang, Chih-Ming Lai, Hui-Zhong Zhuang, Jung-Chan Yang +6 more | 2020-08-04 |
| 10727113 | Methods of forming metal layer structures in semiconductor devices | Ethan Hsiao, Chien-Wen Lai, Chih-Ming Lai, Cheng-Chi Chuang, Hsin-Ping Chen +1 more | 2020-07-28 |
| 10672665 | Fin field effect transistor device structure and method for forming the same | Shang-Wen Chang, Yi-Hsun Chiu | 2020-06-02 |
| 10522633 | Methods and structures of novel contact feature | Wei-Hao Wu, Chia-Hao Chang, Chih-Hao Wang, Jia-Chuan You, Zhi-Chang Lin +2 more | 2019-12-31 |
| 10504775 | Methods of forming metal layer structures in semiconductor devices | Ethan Hsiao, Chien-Wen Lai, Chih-Ming Lai, Cheng-Chi Chuang, Hsin-Ping Chen +1 more | 2019-12-10 |
| 10446555 | Buried metal track and methods forming same | Pochun Wang, Ting-Wei Chiang, Chih-Ming Lai, Hui-Zhong Zhuang, Jung-Chan Yang +6 more | 2019-10-15 |
| 10276491 | Interconnect structure and methods thereof | Shang-Wen Chang | 2019-04-30 |
| 10170404 | Monolithic 3D integration inter-tier vias insertion scheme and associated layout structure | Ta-Pen Guo, Carlos H. Diaz, Jean-Pierre Colinge | 2019-01-01 |
| 10134863 | Vertical semiconductor device structure and method of forming | Yi-Hsun Chiu | 2018-11-20 |
| 10096597 | Re-grown gate structure and fabrication method thereof | Yu-Xuan Huang, Ching-Wei Tsai, Chih-Hao Wang, Chung-Cheng Wu, Guo-Yung Chen +2 more | 2018-10-09 |
| 9892224 | Method of forming masks | Ta-Pen Guo, Yi-Hsun Chiu | 2018-02-13 |
| 9728505 | Methods and structrues of novel contact feature | Wei-Hao Wu, Chia-Hao Chang, Chih-Hao Wang, Jia-Chuan You, Zhi-Chang Lin +2 more | 2017-08-08 |
| 9691695 | Monolithic 3D integration inter-tier vias insertion scheme and associated layout structure | Ta-Pen Guo, Carlos H. Diaz, Jean-Pierre Colinge | 2017-06-27 |
| 9564363 | Method of forming butted contact | Chih-Hao Wang, Chun-Hsiung Lin, Chia-Hao Chang, Jia-Chuan You, Wei-Hao Wu +1 more | 2017-02-07 |
| 9412595 | Systems and methods for intelligent dispatching for wafer processing | Kuo-Yuan Ho, Li-Jen Chen, Chih-Cheng Kao, Shih-Ting Zeng | 2016-08-09 |