Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417955 | Thermal sensor device by back end of line metal resistor | Yu-Hsiang Chen, Hsiu-Wen Hsueh, Szu-Lin Liu, Chloe Chen, Wei-Lin Lai | 2025-09-16 |
| 12347770 | One-time-programmable device structure | Yu-Hsiang Chen, Po-Hsiang Huang, Hsiu-Wen Hsueh | 2025-07-01 |
| 12165947 | Semiconductor devices and method for forming the same | Yung-Shih Cheng, Jiing-Feng Yang, Yu-Hsiang Chen, Chii-Ping Chen | 2024-12-10 |
| 12159830 | Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect | Hui-Chun LEE, Po-Hsiang Huang, Jen Hung Wang, Su-Jen Sung, Chih-Chien Chi +1 more | 2024-12-03 |
| 12119262 | Semiconductor device structure with resistive element | Hsiu-Wen Hsueh, Yu-Hsiang Chen, Chii-Ping Chen | 2024-10-15 |
| 12074107 | Structure and method of forming a semiconductor device with resistive elements | Hong-Wei Chan, Yung-Shih Cheng | 2024-08-27 |
| 12068377 | Back-end-of-line devices | Yu-Hsiang Chen, Po-Hsiang Huang, Hsing-Leo Tsai, Chia-En Huang | 2024-08-20 |
| 12040178 | Method for manufacturing semiconductor structure with resistive elements | Hsiu-Wen Hsueh, Yu-Hsiang Chen, Chii-Ping Chen, Wan-Te Chen | 2024-07-16 |
| 11942390 | Thermal dissipation in semiconductor devices | Yu-Hsiang Chen, Chii-Ping Chen | 2024-03-26 |
| 11923295 | Interconnect level with high resistance layer and method of forming the same | Hong-Wei Chan, Yung-Shih Cheng, Yu-Hsiang Chen | 2024-03-05 |
| 11901289 | Semiconductor device structure with resistive element | Wan-Te Chen, Chung-Hui Chen, Wei-Chih Chen, Chii-Ping Chen, Bi-Ling Lin +1 more | 2024-02-13 |
| 11798848 | Semiconductor device structure with resistive element | Hsiu-Wen Hsueh, Yu-Hsiang Chen, Chii-Ping Chen | 2023-10-24 |
| 11799001 | Back-end-of-line devices | Yu-Hsiang Chen, Po-Hsiang Huang, Hsing-Leo Tsai, Chia-En Huang | 2023-10-24 |
| 11670501 | Semiconductor device structure with resistive elements | Hsiu-Wen Hsueh, Yu-Hsiang Chen, Chii-Ping Chen, Wan-Te Chen | 2023-06-06 |
| 11532548 | Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect | Hui-Chun LEE, Po-Hsiang Huang, Jen Hung Wang, Su-Jen Sung, Chih-Chien Chi +1 more | 2022-12-20 |
| 11437313 | Structure and method of forming a semiconductor device with resistive elements | Hong-Wei Chan, Yung-Shih Cheng | 2022-09-06 |
| 11404369 | Semiconductor device structure with resistive element | Wan-Te Chen, Chung-Hui Chen, Wei-Chih Chen, Chii-Ping Chen, Bi-Ling Lin +1 more | 2022-08-02 |
| 11355410 | Thermal dissipation in semiconductor devices | Yu-Hsiang Chen, Chii-Ping Chen | 2022-06-07 |
| 11217482 | Method for forming semiconductor device with resistive element | Hsiu-Wen Hsueh, Yu-Hsiang Chen, Chii-Ping Chen | 2022-01-04 |
| 10985011 | Structure and formation method of semiconductor device with resistive elements | Hsiu-Wen Hsueh, Yu-Hsiang Chen, Chii-Ping Chen, Wan-Te Chen | 2021-04-20 |
| 10515852 | Structure and formation method of semiconductor device with resistive element | Hsiu-Wen Hsueh, Yu-Hsiang Chen, Chii-Ping Chen | 2019-12-24 |
| 10304772 | Semiconductor device structure with resistive element | Wan-Te Chen, Chung-Hui Chen, Wei-Chih Chen, Chii-Ping Chen, Bi-Ling Lin +1 more | 2019-05-28 |
| 10164002 | Semiconductor device and layout method | Wan-Te Chen, Chung-Hui Chen, Chii-Ping Chen, Chung-Yi Lin | 2018-12-25 |
| 9147020 | Transmission line characterization using EM calibration | Hsiu-Ying Cho, Jiun-Kai Huang, Chin-Wei Kuo, Min-Chie Jeng | 2015-09-29 |
| 8796095 | Integrated method for forming metal gate FinFET devices | Chia-Pin Lin, Tian Choy Gan, Chia-Lung HUNG, Hsien-Chin Lin, Shyue-Shyh Lin | 2014-08-05 |