Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12230603 | Method of fabricating a semiconductor chip having strength adjustment pattern in bonding layer | Hong-Wei Chan, Jiing-Feng Yang, Yao-Te Huang, Hui Yu Lee | 2025-02-18 |
| 12165947 | Semiconductor devices and method for forming the same | Wen-Sheh Huang, Jiing-Feng Yang, Yu-Hsiang Chen, Chii-Ping Chen | 2024-12-10 |
| 12142574 | Semiconductor devices and methods of manufacture | Yao-Te Huang, Hong-Wei Chan, Jiing-Feng Yang, Hui Yu Lee | 2024-11-12 |
| 12074107 | Structure and method of forming a semiconductor device with resistive elements | Hong-Wei Chan, Wen-Sheh Huang | 2024-08-27 |
| 11923295 | Interconnect level with high resistance layer and method of forming the same | Hong-Wei Chan, Wen-Sheh Huang, Yu-Hsiang Chen | 2024-03-05 |
| 11908829 | Integrated circuit package and method of forming same | Yao-Te Huang, Hong-Wei Chan | 2024-02-20 |
| 11764143 | Increasing contact areas of contacts for MIM capacitors | Yao-Te Huang | 2023-09-19 |
| 11756924 | Method of fabricating a semiconductor chip having strength adjustment pattern in bonding layer | Hong-Wei Chan, Jiing-Feng Yang, Yao-Te Huang, Hui Yu Lee | 2023-09-12 |
| 11437313 | Structure and method of forming a semiconductor device with resistive elements | Hong-Wei Chan, Wen-Sheh Huang | 2022-09-06 |
| 9099530 | Methods of patterning small via pitch dimensions | Chung-Yi Lin, Jiing-Feng Yang, Tzu-Hao Huang, Chih-Hao Hsieh, Dian-Hau Chen +2 more | 2015-08-04 |
| 8728332 | Methods of patterning small via pitch dimensions | Chung-Yi Lin, Jiing-Feng Yang, Tzu-Hao Huang, Chih-Hao Hsieh, Dian-Hau Chen +2 more | 2014-05-20 |