Issued Patents All Time
Showing 26–50 of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081563 | Formation of silicide contacts in semiconductor devices | Yan-Ming Tsai, Fang Chen, Chii-Ming Wu | 2021-08-03 |
| 11062941 | Contact conductive feature formation and structure | Ken-Yu Chang, Chun-I Tsai, Ming-Hsing Tsai | 2021-07-13 |
| 10971396 | Conductive feature formation and structure | Yu-Shih Wang, Chun-I Tsai, Shian Wei Mao, Ken-Yu Chang, Ming-Hsing Tsai | 2021-04-06 |
| 10943823 | Conductive feature formation and structure using bottom-up filling deposition | Pin-Wen Chen, Chia-Han Lai, Chih-Wei Chang, Mei-Hui Fu, Ming-Hsing Tsai +3 more | 2021-03-09 |
| 10580693 | Contact conductive feature formation and structure | Ken-Yu Chang, Chun-I Tsai, Ming-Hsing Tsai | 2020-03-03 |
| 10535748 | Method of forming a contact with a silicide region | Yu-Wen Cheng, Cheng-Tung Lin, Chih-Wei Chang, Hong-Mao Lee, Ming-Hsing Tsai +6 more | 2020-01-14 |
| 10510664 | Contact structure and formation thereof | Hong-Mao Lee, Huicheng Chang, Chia-Han Lai, Chi-Hsuan Ni, Cheng-Tung Lin +4 more | 2019-12-17 |
| 10504834 | Contact structure and the method of forming the same | Yu-Wen Cheng, Wei-Yip Loh, Yu-Hsiang Liao, Sheng-Hsuan Lin, Hong-Mao Lee +4 more | 2019-12-10 |
| 10475702 | Conductive feature formation and structure using bottom-up filling deposition | Pin-Wen Chen, Chia-Han Lai, Chih-Wei Chang, Mei-Hui Fu, Ming-Hsing Tsai +3 more | 2019-11-12 |
| 10418279 | Method of forming contact metal | Chun-Hsien Huang, Hong-Mao Lee, Hsien-Lung Yang, Yu-Kai Chen | 2019-09-17 |
| 10361120 | Conductive feature formation and structure | Yu-Shih Wang, Chun-I Tsai, Shian Wei Mao, Ken-Yu Chang, Ming-Hsing Tsai | 2019-07-23 |
| 10283359 | Systems and methods for gap filling improvement | Chi-Yuan Chen, Li-Ting Wang, Teng-Chun Tsai, Chun-I Tsai, Huang-Yi Huang +2 more | 2019-05-07 |
| 9978583 | Opening fill process and structures formed thereby | Chun-I Tsai, Chi-Yuan Chen, Chia-Han Lai | 2018-05-22 |
| 9735107 | Contact structure and formation thereof | Hong-Mao Lee, Huicheng Chang, Chia-Han Lai, Chi-Hsuan Ni, Cheng-Tung Lin +4 more | 2017-08-15 |
| 9711402 | Method of forming contact metal | Chun-Hsien Huang, Hong-Mao Lee, Hsien-Lung Yang, Yu-Kai Chen | 2017-07-18 |
| 9624576 | Systems and methods for gap filling improvement | Chi-Yuan Chen, Li-Ting Wang, Teng-Chun Tsai, Chun-I Tsai, Huang-Yi Huang +2 more | 2017-04-18 |
| 9627313 | Opening fill process and structure formed thereby | Chun-I Tsai, Chi-Yuan Chen, Chia-Han Lai | 2017-04-18 |
| 9589892 | Interconnect structure and method of forming the same | Yu-Hung Lin, Mei-Hui Fu, You-Hua Chou, Chia-Lin Hsu, Hon-Lin Huang +1 more | 2017-03-07 |
| 9520327 | Methods of forming low resistance contacts | Chun-Wen Nieh, Hung-Chang Hsu, Yan-Ming Tsai, Chen-Ming Lee, Mei-Yun Wang | 2016-12-13 |
| 9385080 | Interconnect structure and method of forming the same | Yu-Hung Lin, Mei-Hui Fu, You-Hua Chou, Chia-Lin Hsu, Hon-Lin Huang +1 more | 2016-07-05 |
| 9368357 | Directional pre-clean in silicide and contact formation | Chih-Wei Chang, Hung-Chang Hsu, Chun-Hsien Huang, Yu-Hung Lin, Li-Wei Chu +2 more | 2016-06-14 |
| 9287170 | Contact structure and formation thereof | Hong-Mao Lee, Teng-Chun Tsai, Li-Ting Wang, Chi-Yuan Chen, Cheng-Tung Lin +4 more | 2016-03-15 |
| 9245797 | Opening fill process and structure formed thereby | Chun-I Tsai, Chi-Yuan Chen, Chia-Han Lai | 2016-01-26 |
| 9230795 | Directional pre-clean in silicide and contact formation | Yu-Shiuan Wang, Hung-Chang Hsu, Li-Wei Chu, Sheng-Hsuan Lin, Chun-Hsien Huang +2 more | 2016-01-05 |
| 9219009 | Method of integrated circuit fabrication | Chia-Han Lai, Chun-I Tsai | 2015-12-22 |