Issued Patents All Time
Showing 126–150 of 166 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502647 | Resistive random-access memory (RRAM) with a low-K porous layer | Ting-Chang Chang, Kuan-Chang Chang, Tsung-Ming Tsai, Chih-Hung Pan, Ying-Lang Wang +2 more | 2016-11-22 |
| 9477258 | Clock tree in circuit having a power-mode control circuit to determine a first delay time and a second delay time | Yow-Tyng Nieh, Shih-Hsu Huang, Chung-Han Chou | 2016-10-25 |
| 9450047 | Semiconductor structure having enlarged regrowth regions and manufacturing method of the same | Chin-I Liao, Hsiu-Ting Chen, Shih-Hsien Cheng | 2016-09-20 |
| 9418948 | Method of making bond pad | Chiang-Ming Chuang, Chun-Che Huang | 2016-08-16 |
| 9419155 | Sensing product and method of making | Yu-Ku Lin, Ying-Lang Wang | 2016-08-16 |
| 9406797 | Semiconductor integrated circuit with dislocations | Shiu-Ko JangJian, Chun-Chieh Wang, Ying-Min Chou | 2016-08-02 |
| 9380223 | Device for contactlessly testing passive routing substrates | Jui-Hung Chien, Hao Yu, Ruei-Siang Hsu, Hsueh-Ju Lin | 2016-06-28 |
| 9281475 | Resistive random-access memory (RRAM) with multi-layer device structure | Ting-Chang Chang, Kuan-Chang Chang, Tsung-Ming Tsai, Chih-Hung Pan, Ying-Lang Wang +2 more | 2016-03-08 |
| 9252109 | Method of making bond pad | Chiang-Ming Chuang, Chun-Che Huang | 2016-02-02 |
| 9224773 | Metal shielding layer in backside illumination image sensor chips and methods for forming the same | Jian-Shin Tsai, Chih-Chang Huang, Ing-Ju Lee, Ching-Yao Sun, Jyun-Ru Wu +3 more | 2015-12-29 |
| 9224691 | Semiconductor device contact structures | Chih-Chung Chang, Kei-Wei Chen, Ying-Lang Wang | 2015-12-29 |
| 9177940 | Fault-tolerant unit and method for through-silicon via | Chiao-Ling Lung, Yu-Shih Su, Yiyu Shi | 2015-11-03 |
| 9159660 | Semiconductor package structure and method for making the same | Chin-Tang Hsieh, Chih-Ming Kuo, Chia-Jung Tu, Chih-Hsien Ni, Lung-Hua Ho +2 more | 2015-10-13 |
| 9070664 | Device with MOS device including a secondary metal and PVD tool with target for making same | Ying-Lang Wang, Kei-Wei Chen | 2015-06-30 |
| 9059260 | Semiconductor manufacturing method and semiconductor structure thereof | Chih-Ming Kuo, Lung-Hua Ho, Chia-Yeh Huang, Chin-Tang Hsieh | 2015-06-16 |
| 8959972 | Top cap of bicycle handlebar stem tube and method for manufacturing same | Ting-Chi Chang | 2015-02-24 |
| 8891299 | MOSFET having memory characteristics | Ting-Chang Chang, Chih-Hao Dai, Fu-Yen Jian, Wen-Hung Lo, Ying-Lang Wang | 2014-11-18 |
| 8823169 | Semiconductor manufacturing method and semiconductor structure thereof | Chih-Ming Kuo, Lung-Hua Ho, Chia-Yeh Huang, Chin-Tang Hsieh | 2014-09-02 |
| 8796851 | Bonding pad and method of making same | Chiang-Ming Chuang, Chun-Che Huang | 2014-08-05 |
| 8759928 | Image sensor cross-talk reduction system and method | Jian-Shin Tsai, Chih-Chang Huang, Ing-Ju Lee, Chi-Cheng Hung, Jun-Nan Nian +1 more | 2014-06-24 |
| 8704345 | Semiconductor package and lead frame thereof | Chih-Ming Kuo, Chih-Hsien Ni, Chin-Tang Hsieh, Chia-Jung Tu, Lung-Hua Ho | 2014-04-22 |
| 8658466 | Semiconductor package structure and method for making the same | Chin-Tang Hsieh, Chih-Ming Kuo, Chia-Jung Tu, Chih-Hsien Ni, Lung-Hua Ho +2 more | 2014-02-25 |
| 8642439 | Semiconductor device and method of formation | Jun-Nan Nian, Li-Yen Fang, Yu-Ting Lin, Yu-Ku Lin, Ying-Lang Wang | 2014-02-04 |
| 8610230 | HfO2/SiO2-Si interface improvement for CMOS image sensor | Jun-Nan Nian, Chi-Cherng Jeng, Shiu-Ko JangJian, Yu-Te Hung | 2013-12-17 |
| 8581384 | Semiconductor package structure | Chin-Tang Hsieh, Chih-Ming Kuo, Chia-Jung Tu, Lung-Hua Ho, Chih-Hsien Ni | 2013-11-12 |