Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11018176 | Metal shielding layer in backside illumination image sensor chips and methods for forming the same | Shih-Chieh Chang, Jian-Shin Tsai, Chih-Chang Huang, Ing-Ju Lee, Ching-Yao Sun +3 more | 2021-05-25 |
| 10879629 | Method of electroplating metal into recessed feature and electroplating layer in recessed feature | Jun-Nan Nian, Shiu-Ko JangJian, Yu-Ren PENG, Chi-Cheng Hung, Yu-Sheng Wang | 2020-12-29 |
| 10749278 | Method of electroplating metal into recessed feature and electroplating layer in recessed feature | Jun-Nan Nian, Shiu-Ko JangJian, Yu-Ren PENG, Chi-Cheng Hung, Yu-Sheng Wang | 2020-08-18 |
| 10276621 | Metal shielding layer in backside illumination image sensor chips and methods for forming the same | Shih-Chieh Chang, Jian-Shin Tsai, Chih-Chang Huang, Ing-Ju Lee, Ching-Yao Sun +3 more | 2019-04-30 |
| 9620555 | Metal shielding layer in backside illumination image sensor chips and methods for forming the same | Shih-Chieh Chang, Jian-Shin Tsai, Chih-Chang Huang, Ing-Ju Lee, Ching-Yao Sun +3 more | 2017-04-11 |
| 9224773 | Metal shielding layer in backside illumination image sensor chips and methods for forming the same | Shih-Chieh Chang, Jian-Shin Tsai, Chih-Chang Huang, Ing-Ju Lee, Ching-Yao Sun +3 more | 2015-12-29 |