Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424551 | Semiconductor structure and method of manufacturing the same | You-Ming Hsu, Chun-Ting Kuo, Lung-Hua Ho, Chih-Ming Kuo | 2025-09-23 |
| 10797213 | Chip package and chip thereof | Cheng-Hung Shih | 2020-10-06 |
| 10580729 | Chip on film package and flexible substrate thereof | Chun-Te Lee | 2020-03-03 |
| 10504828 | Semiconductor package and circuit substrate thereof | — | 2019-12-10 |
| 10327334 | Layout structure of flexible circuit board | — | 2019-06-18 |
| 9961759 | Flexible substrate | Fei Wu, Chia-Jung Tu | 2018-05-01 |
| 9653376 | Heat dissipation package structure | — | 2017-05-16 |
| 9510441 | Flexible substrate | Fei Wu, Chia-Jung Tu | 2016-11-29 |
| 9159660 | Semiconductor package structure and method for making the same | Chih-Ming Kuo, Chia-Jung Tu, Shih-Chieh Chang, Chih-Hsien Ni, Lung-Hua Ho +2 more | 2015-10-13 |
| 9059260 | Semiconductor manufacturing method and semiconductor structure thereof | Chih-Ming Kuo, Lung-Hua Ho, Shih-Chieh Chang, Chia-Yeh Huang | 2015-06-16 |
| 9000569 | Semiconductor structure | You-Ming Hsu, Ming-Sheng Liu, Chih-Ping Wang | 2015-04-07 |
| 8981536 | Semiconductor structure | You-Ming Hsu, Ming-Sheng Liu, Chih-Ping Wang | 2015-03-17 |
| 8841767 | Bumping process and structure thereof | Chih-Ming Kuo | 2014-09-23 |
| 8823169 | Semiconductor manufacturing method and semiconductor structure thereof | Chih-Ming Kuo, Lung-Hua Ho, Shih-Chieh Chang, Chia-Yeh Huang | 2014-09-02 |
| 8796824 | Semiconductor structure | Shyh-Jen Guo, You-Ming Hsu | 2014-08-05 |
| 8704345 | Semiconductor package and lead frame thereof | Chih-Ming Kuo, Shih-Chieh Chang, Chih-Hsien Ni, Chia-Jung Tu, Lung-Hua Ho | 2014-04-22 |
| 8658466 | Semiconductor package structure and method for making the same | Chih-Ming Kuo, Chia-Jung Tu, Shih-Chieh Chang, Chih-Hsien Ni, Lung-Hua Ho +2 more | 2014-02-25 |
| 8581384 | Semiconductor package structure | Chih-Ming Kuo, Chia-Jung Tu, Shih-Chieh Chang, Lung-Hua Ho, Chih-Hsien Ni | 2013-11-12 |
| 8497571 | Thin flip chip package structure | Hou-Chang Kuo, Dueng-Shiu Tzou, Chia-Jung Tu, Gwo-Shyan Sheu | 2013-07-30 |
| 8476159 | Substrate structure with compliant bump and manufacturing method thereof | — | 2013-07-02 |
| 8471372 | Thin flip chip package structure | Hou-Chang Kuo, Dueng-Shiu Tzou, Chia-Jung Tu, Gwo-Shyan Sheu | 2013-06-25 |
| 8450203 | Bumping process and structure thereof | Chih-Ming Kuo | 2013-05-28 |
| 8426984 | Substrate structure with compliant bump and manufacturing method thereof | — | 2013-04-23 |
| D430924 | Faucet handle | Ming-Te Wei, Philip F. Friedrich | 2000-09-12 |
| D427666 | Faucet body | Ming-Te Wei, Philip F. Friedrich | 2000-07-04 |