| 12424551 |
Semiconductor structure and method of manufacturing the same |
Chin-Tang Hsieh, You-Ming Hsu, Chun-Ting Kuo, Chih-Ming Kuo |
2025-09-23 |
| 12224183 |
Method of manufacturing semiconductor device |
Shrane-Ning Jenq, Wen-Cheng Hsu, Chen-Yu Wang, Chih-Ming Kuo, Chwan-Tyaw Chen |
2025-02-11 |
| 11651974 |
Semiconductor package and method of fabricating the same |
Chih-Ming Kuo, You-Ming Hsu, Fei Wu |
2023-05-16 |
| 9159660 |
Semiconductor package structure and method for making the same |
Chin-Tang Hsieh, Chih-Ming Kuo, Chia-Jung Tu, Shih-Chieh Chang, Chih-Hsien Ni +2 more |
2015-10-13 |
| 9059260 |
Semiconductor manufacturing method and semiconductor structure thereof |
Chih-Ming Kuo, Shih-Chieh Chang, Chia-Yeh Huang, Chin-Tang Hsieh |
2015-06-16 |
| 8823169 |
Semiconductor manufacturing method and semiconductor structure thereof |
Chih-Ming Kuo, Shih-Chieh Chang, Chia-Yeh Huang, Chin-Tang Hsieh |
2014-09-02 |
| 8772644 |
Carrier with three-dimensional capacitor |
Chih-Ming Kuo, You-Ming Hsu |
2014-07-08 |
| 8704345 |
Semiconductor package and lead frame thereof |
Chih-Ming Kuo, Shih-Chieh Chang, Chih-Hsien Ni, Chin-Tang Hsieh, Chia-Jung Tu |
2014-04-22 |
| 8692390 |
Pyramid bump structure |
Chih-Hung Wu, Chih-Ming Kuo, Cheng-Hung Shih, Yie-Chuan Chiu |
2014-04-08 |
| 8658466 |
Semiconductor package structure and method for making the same |
Chin-Tang Hsieh, Chih-Ming Kuo, Chia-Jung Tu, Shih-Chieh Chang, Chih-Hsien Ni +2 more |
2014-02-25 |
| 8658528 |
Bumping process and structure thereof |
Chih-Ming Kuo, Yie-Chuan Chiu |
2014-02-25 |
| 8581384 |
Semiconductor package structure |
Chin-Tang Hsieh, Chih-Ming Kuo, Chia-Jung Tu, Shih-Chieh Chang, Chih-Hsien Ni |
2013-11-12 |
| 8450049 |
Process for forming an anti-oxidant metal layer on an electronic device |
Chih-Ming Kuo, Yie-Chuan Chiu, Cheng-Hung Shih |
2013-05-28 |
| 8415243 |
Bumping process and structure thereof |
Chih-Ming Kuo, Yie-Chuan Chiu |
2013-04-09 |