| 9961759 |
Flexible substrate |
Chin-Tang Hsieh, Fei Wu |
2018-05-01 |
| 9929051 |
Wafer dicing method |
Chih-Lung Chen, Wen-Hsiang Liao, Chung-Hsiang Wei, Yung-Chi Liu |
2018-03-27 |
| 9510441 |
Flexible substrate |
Chin-Tang Hsieh, Fei Wu |
2016-11-29 |
| 9159660 |
Semiconductor package structure and method for making the same |
Chin-Tang Hsieh, Chih-Ming Kuo, Shih-Chieh Chang, Chih-Hsien Ni, Lung-Hua Ho +2 more |
2015-10-13 |
| 8704345 |
Semiconductor package and lead frame thereof |
Chih-Ming Kuo, Shih-Chieh Chang, Chih-Hsien Ni, Chin-Tang Hsieh, Lung-Hua Ho |
2014-04-22 |
| 8658466 |
Semiconductor package structure and method for making the same |
Chin-Tang Hsieh, Chih-Ming Kuo, Shih-Chieh Chang, Chih-Hsien Ni, Lung-Hua Ho +2 more |
2014-02-25 |
| 8581384 |
Semiconductor package structure |
Chin-Tang Hsieh, Chih-Ming Kuo, Shih-Chieh Chang, Lung-Hua Ho, Chih-Hsien Ni |
2013-11-12 |
| 8497571 |
Thin flip chip package structure |
Chin-Tang Hsieh, Hou-Chang Kuo, Dueng-Shiu Tzou, Gwo-Shyan Sheu |
2013-07-30 |
| 8471372 |
Thin flip chip package structure |
Chin-Tang Hsieh, Hou-Chang Kuo, Dueng-Shiu Tzou, Gwo-Shyan Sheu |
2013-06-25 |