Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8497571 | Thin flip chip package structure | Chin-Tang Hsieh, Hou-Chang Kuo, Chia-Jung Tu, Gwo-Shyan Sheu | 2013-07-30 |
| 8471372 | Thin flip chip package structure | Chin-Tang Hsieh, Hou-Chang Kuo, Chia-Jung Tu, Gwo-Shyan Sheu | 2013-06-25 |