Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412825 | Semiconductor package | Yu Ma, Pei-Wen Wang, Hsin-Hao Huang | 2025-09-09 |
| 11812554 | Layout structure of a flexible circuit board | Yu Ma, Hsin-Hao Huang, Wen-Fu Chou | 2023-11-07 |
| 11606860 | Flexible circuit board | Hsin-Hao Huang, Yu Ma, Chia-Hsin Yen | 2023-03-14 |
| 11581283 | Flip chip package and circuit board thereof | Yu Ma, Hsin-Hao Huang, Wen-Fu Chou | 2023-02-14 |
| 11322437 | Flip chip interconnection and circuit board thereof | Yu Ma, Hsin-Hao Huang, Wen-Fu Chou | 2022-05-03 |
| 11309238 | Layout structure of a flexible circuit board | Yu Ma, Hsin-Hao Huang, Wen-Fu Chou | 2022-04-19 |
| 10999928 | Circuit board | Yu Ma, Hsin-Hao Huang, Wen-Fu Chou | 2021-05-04 |
| 10993319 | Chip package and circuit board thereof | Yu Ma, Hsin-Hao Huang, Wen-Fu Chou | 2021-04-27 |
| 8497571 | Thin flip chip package structure | Chin-Tang Hsieh, Hou-Chang Kuo, Dueng-Shiu Tzou, Chia-Jung Tu | 2013-07-30 |
| 8471372 | Thin flip chip package structure | Chin-Tang Hsieh, Hou-Chang Kuo, Dueng-Shiu Tzou, Chia-Jung Tu | 2013-06-25 |