YC

Yie-Chuan Chiu

CT Chipbond Technology: 4 patents #19 of 88Top 25%
Overall (All Time): #1,217,404 of 4,157,543Top 30%
4
Patents All Time

Issued Patents All Time

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
8692390 Pyramid bump structure Chih-Hung Wu, Lung-Hua Ho, Chih-Ming Kuo, Cheng-Hung Shih 2014-04-08
8658528 Bumping process and structure thereof Chih-Ming Kuo, Lung-Hua Ho 2014-02-25
8450049 Process for forming an anti-oxidant metal layer on an electronic device Chih-Ming Kuo, Cheng-Hung Shih, Lung-Hua Ho 2013-05-28
8415243 Bumping process and structure thereof Chih-Ming Kuo, Lung-Hua Ho 2013-04-09