Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8796824 | Semiconductor structure | Chin-Tang Hsieh, You-Ming Hsu | 2014-08-05 |
| 8437142 | Bump structure and process of manufacturing the same | Cheng-Hung Shih, Wen-Tung Chen | 2013-05-07 |
| 8330280 | Bump structure and process of manufacturing the same | Cheng-Hung Shih, Wen-Tung Chen | 2012-12-11 |
| 5935876 | Via structure using a composite dielectric layer | Chiarn-Lung Lee, Wei-Kun Yeh | 1999-08-10 |