Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6440859 | Method for etching passivation layer of wafer | Jun Peng, Wei-Kun Yeh | 2002-08-27 |
| 6294483 | Method for preventing delamination of APCVD BPSG films | Je-Won Wang, Han-Chung Chen | 2001-09-25 |
| 6245688 | Dry Air/N2 post treatment to avoid the formation of B/P precipitation after BPSG film deposition | Yuan JING, Han-Chung Chen | 2001-06-12 |
| 6090675 | Formation of dielectric layer employing high ozone:tetraethyl-ortho-silicate ratios during chemical vapor deposition | Han-Chung Chen, Je-Won Wang | 2000-07-18 |
| 5935876 | Via structure using a composite dielectric layer | Wei-Kun Yeh, Shyh-Jen Guo | 1999-08-10 |
| 5865900 | Etch method for removing metal-fluoropolymer residues | Huai-Jen Shu, Ying-Tzu Yen | 1999-02-02 |