KY

Kuo-Nan Yang

TSMC: 111 patents #219 of 12,232Top 2%
RS Realtek Semiconductor: 3 patents #447 of 1,741Top 30%
AI Aiwa: 1 patents #33 of 72Top 50%
AM Ampex: 1 patents #119 of 247Top 50%
📍 Hsinchu, CA: #18 of 400 inventorsTop 5%
Overall (All Time): #9,686 of 4,157,543Top 1%
121
Patents All Time

Issued Patents All Time

Showing 101–121 of 121 patents

Patent #TitleCo-InventorsDate
9058462 System and method for leakage estimation for standard integrated circuit cells with shared polycrystalline silicon-on-oxide definition-edge (PODE) King-Ho Tam, Yeh-Chi Chang, Zhe-Wei Jiang, Chung-Hsing Wang 2015-06-16
9047433 Cell and macro placement on fin grid Chou-Kun Lin, Jerry Chang Jui Kao, Yi-Chuin Tsai, Chien-Ju Chao, Chung-Hsing Wang 2015-06-02
8937358 Channel doping extension beyond cell boundaries Chou-Kun Lin, Jerry Chang Jui Kao, Yi-Chuin Tsai, Chien-Ju Chao, Chung-Hsing Wang 2015-01-20
8847284 Integrated circuit with standard cells Chou-Kun Lin, Jerry Chang Jui Kao, Yi-Chuin Tsai, Chien-Ju Chao, Chung-Hsing Wang 2014-09-30
8547985 Network interface controller capable of sharing buffers and buffer sharing method Yen-Hsu Shih, Chia-Ying Chiu, Kai-Wen Cheng 2013-10-01
7943986 Method for fabricating a body contact in a finfet structure and a device including the same Yi Chen, Hou-Yu Chen, Fu-Liang Yang, Chenming Hu 2011-05-17
7312136 Method of fabricating a wafer with strained channel layers for increased electron and hole mobility for improving device performance Chien-Chao Huang, Yee-Chia Yeo, Chun-Chieh Lin, Chenming Hu 2007-12-25
7244640 Method for fabricating a body contact in a Finfet structure and a device including the same Yi Chen, Hou-Yu Chen, Fu-Liang Yang, Chenming Hu 2007-07-17
7187000 High performance tunneling-biased MOSFET and a process for its manufacture Yi-Ling Chang, You-Lin Chu, Hou-Yu Chen, Fu-Liang Yang, Chenming Hu 2007-03-06
7122412 Method of fabricating a necked FINFET device Haur-Ywh Chen, Fang Chen, Yi-Ling Chan, Fu-Liang Yang, Chenming Hu 2006-10-17
6812116 Method of fabricating a wafer with strained channel layers for increased electron and hole mobility for improving device performance Chien-Chao Huang, Yee-Chia Yeo, Chun-Chieh Lin, Chenming Hu 2004-11-02
6784071 Bonded SOI wafer with <100> device layer and <110> substrate for performance improvement Haur-Ywh Chen, Yi-Ling Chan, Fu-Liang Yang, Chenming Hu 2004-08-31
6674130 High performance PD SOI tunneling-biased MOSFET Yi-Ling Chan, You-Lin Chu, Hou-Yu Chen, Fu-Liang Yang, Chenming Hu 2004-01-06
6518105 High performance PD SOI tunneling-biased MOSFET Yi-Ling Chan, You-Lin Chu, Hou-Yu Chen, Fu-Liang Yang, Chenming Hu 2003-02-11
6417989 Multiple-gap magnetic thin-film head with improved read/write coil arrangement 2002-07-09
5503786 Method for forming air chamber in shoe sole 1996-04-02
5426537 Method and apparatus for automatically adjusting the overshoot of a record head in response to the record head gap depth Nan-Hsiung Yeh, Charles R. Olson, George R. Varian 1995-06-20
5352105 EVA sole molding die assembly 1994-10-04
5318645 EVA insole manufacturing process 1994-06-07
5308420 EVA insole manufacturing process 1994-05-03
5141578 EVA insole manufacturing process 1992-08-25