Issued Patents All Time
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8247322 | Via/contact and damascene structures and manufacturing methods thereof | Shih-Chieh Chang, Ying-Lang Wang, Kei-Wei Chen, Yu-Sheng Wang | 2012-08-21 |
| 7969708 | Alpha tantalum capacitor plate | Miao-Cheng Liao, Phil Sun, Kei-Wei Chen | 2011-06-28 |
| 7667835 | Apparatus and method for preventing copper peeling in ECP | Hsi-Kuei Cheng, Hsien-Ping Feng, Ming-Yuan Cheng, Steven Lin, Ray Chuang | 2010-02-23 |
| 7481910 | Method and apparatus for stabilizing plating film impurities | Hsien-Ping Feng, Ming-Yuang Cheng, Si Cheng, Steven Lin, Chen-Peng Fan +1 more | 2009-01-27 |
| 7432192 | Post ECP multi-step anneal/H2 treatment to reduce film impurity | Hsien-Ping Feng, Hsi-Kuei Cheng, Chih-Tsung Lee, Ming-Yuan Cheng, Steven Lin +2 more | 2008-10-07 |
| 7417321 | Via structure and process for forming the same | Kei-Wei Chen, Ying-Jing Lu, Yu-Sheng Wang, Yu-Ku Lin | 2008-08-26 |
| 7368379 | Multi-layer interconnect structure for semiconductor devices | Kei-Wei Chen, Yu-Ku Lin, Chyi Shyuan Chern | 2008-05-06 |
| 7252750 | Dual contact ring and method for metal ECP process | Chi-Wen Liu, Ke-Wei Chen, Ying-Lang Wang | 2007-08-07 |
| 7208404 | Method to reduce Rs pattern dependence effect | Chi-Wen Li, Kei-Wei Chen, Jye-Wei Hsu, Hsien-Pin Fong, Steven Lin +1 more | 2007-04-24 |
| 7199045 | Metal-filled openings for submicron devices and methods of manufacture thereof | Chi-Wen Liu, Shih-Tzung Chang, Ying-Lang Wang, Kei-Wei Chen | 2007-04-03 |
| 7189650 | Method and apparatus for copper film quality enhancement with two-step deposition | Chi-Wen Liu, Hsien-Ping Feng | 2007-03-13 |
| 7183199 | Method of reducing the pattern effect in the CMP process | Chi-Wen Liu, Shien-Ping Feng, Kei-Wei Chen, Shih-Chi Lin, Ray Chuang | 2007-02-27 |
| 7122471 | Method for preventing voids in metal interconnects | Chi-Wen Liu, Si-Kua Cheng, Che-Tsao Wang, Steven Lin, Hsien-Ping Feng +1 more | 2006-10-17 |
| 7071100 | Method of forming barrier layer with reduced resistivity and improved reliability in copper damascene process | Kei-Wei Chen, Chi-Wen Liu, Jchung-Chang Chen, Shih-Tzung Chang, Shih-Ho Lin +2 more | 2006-07-04 |
| 7030016 | Post ECP multi-step anneal/H2 treatment to reduce film impurity | Hsien-Ping Feng, Hsi-Kuei Cheng, Chih-Tsung Lee, Ming-Yuan Cheng, Steven Lin +2 more | 2006-04-18 |