JT

Jiann-Tyng Tzeng

TSMC: 261 patents #41 of 12,232Top 1%
Overall (All Time): #1,789 of 4,157,543Top 1%
261
Patents All Time

Issued Patents All Time

Showing 26–50 of 261 patents

Patent #TitleCo-InventorsDate
12300609 Two-dimensional (2D) metal structure and method of forming the same Shih-Wei Peng, Ken-Hsien Hsieh 2025-05-13
12288785 Layout designs of integrated circuits having backside routing tracks Wei-An Lai, Shih-Wei Peng, Wei-Cheng Lin 2025-04-29
12283477 Method of manufacturing a semiconductor device Shih-Wei Peng, Chia-Tien Wu 2025-04-22
12283546 Integrated circuit and method for forming the same Shih-Wei Peng, Wei-Cheng Lin, Cheng-Chi Chuang 2025-04-22
12278185 Power distribution method Shih-Wei Peng, Te-Hsin Chiu 2025-04-15
12278238 Semiconductor structure and method of forming the same Shih-Wei Peng, Te-Hsin Chiu, Wei-Cheng Lin 2025-04-15
12266657 Hybrid cell-based device, layout, and method Yu-Xuan Huang, Shih-Wei Peng, Te-Hsin Chiu, Hou-Yu Chen, Kuan-Lun Cheng 2025-04-01
12265775 Semiconductor device with reduced power Shih-Wei Peng, Ching-Yu Huang 2025-04-01
12261116 Backside signal routing Ching-Yu Huang, Wei-Cheng Lin, Shih-Wei Peng, Yi-Kan Cheng 2025-03-25
12261167 Structure and method of power supply routing in semiconductor device Shih-Wei Peng 2025-03-25
12261113 Middle-end-of-line strap for standard cell Meng-Hung Shen, Chih-Liang Chen, Charles Chew-Yuen Young, Kam-Tou Sio, Wei-Cheng Lin 2025-03-25
12261115 Semiconductor devices and methods of manufacturing thereof Kam-Tou Sio 2025-03-25
12255148 Power distribution structure and method Shih-Wei Peng, Te-Hsin Chiu 2025-03-18
12255203 Monolithic three dimensional integrated circuit Kam-Tou Sio, Shih-Wei Peng 2025-03-18
12255238 Integrated circuit, system and method of forming same Shih-Wei Peng, Chih-Min HSIAO 2025-03-18
12237334 Semiconductor structure Shih-Wei Peng, Wei-Cheng Lin 2025-02-25
12230572 Backside signal interconnection Yu-Xuan Huang, Ching-Wei Tsai, Yi-Hsun Chiu, Yi-Bo Liao, Kuan-Lun Cheng +6 more 2025-02-18
12230624 Integrated circuit with mixed row heights Kam-Tou Sio, Chung-Hsing Wang, Yi-Kan Cheng 2025-02-18
12218050 Manufacturing method for semiconductor device Te-Hsin Chiu, Wei-An Lai, Meng-Hung Shen, Wei-Cheng Lin, Kam-Tou Sio 2025-02-04
12218057 Integrated circuit with backside interconnections and method of making same Shih-Wei Peng, Te-Hsin Chiu, Wei-An Lai, Ching-Wei Tsai 2025-02-04
12218141 Hybrid fin field-effect transistor cell structures and related methods Wei-An Lai, Hui-Zhong Zhuang, Wei-Cheng Lin, Lipen Yuan, Yan-Hao Chen 2025-02-04
12204838 Structure and method for tying off dummy gate in semiconductor device Shih-Wei Peng, Meng-Hung Shen, Wei-An Lai 2025-01-21
12183788 Semiconductor arrangement comprising a source pad, gate pad, drain pad, backside interconnect line, and backside contact, and backside conductive line and method of making Shih-Wei Peng 2024-12-31
12170277 Integrated circuit and manufacturing method of the same Kam-Tou Sio 2024-12-17
12148700 Semiconductor device, and associated method and system Shih-Wei Peng, Wei-Cheng Lin 2024-11-19