Issued Patents All Time
Showing 26–41 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145751 | Semiconductor structure with doped contact plug and method for forming the same | Kuo-Ju Chen, Su-Hao Liu, Chun-Hao Kung, Liang-Yin Chen, Huicheng Chang +6 more | 2021-10-12 |
| 11056352 | Magnetic slurry for highly efficient CMP | Yen-Ting Chen, Chun-Hao Kung, Tung-Kai Chen, Kei-Wei Chen | 2021-07-06 |
| 11043396 | Chemical mechanical polish slurry and method of manufacture | Chun-Hao Kung, Tung-Kai Chen, Chih-Chieh Chang, Kao-Feng Liao, Kei-Wei Chen | 2021-06-22 |
| 10957609 | Detecting the cleanness of wafer after post-CMP cleaning | Yu-Ting Yen, Chi-Ming Tsai | 2021-03-23 |
| 10953514 | Chemical mechanical polishing apparatus and method | Shang-Yu Wang, Chun-Hao Kung, Ching-Hsiang Tsai, Kei-Wei Chen | 2021-03-23 |
| 10947414 | Compositions for use in chemical mechanical polishing | Fang-I Chih, Chih-Chieh Chang, Kei-Wei Chen | 2021-03-16 |
| 10843273 | Methods of purifying nanostructures | Kai Hwa Chew, Meng Kiong Lim, Yong Wu | 2020-11-24 |
| 10777423 | Chemical mechanical polishing method | Tung-Kai Chen, Ching-Hsiang Tsai, Kao-Feng Liao, Chih-Chieh Chang, Chun-Hao Kung +4 more | 2020-09-15 |
| 10157801 | Detecting the cleanness of wafer after post-CMP cleaning | Yu-Ting Yen, Chi-Ming Tsai | 2018-12-18 |
| 9966281 | Methods and systems for chemical mechanical polish cleaning | Chien-Ping Lee | 2018-05-08 |
| 9859165 | Planarization process for forming semiconductor device structure | Li-Chieh Wu | 2018-01-02 |
| 9620628 | Methods of forming contact feature | Gin-Chen Huang, Yung-Cheng Lu | 2017-04-11 |
| 9333619 | Adaptive endpoint method for pad life effect on chemical mechanical polishing | Chu-An Lee, Peng-Chung Jangjian | 2016-05-10 |
| 9305851 | Systems and methods for chemical mechanical planarization with fluorescence detection | I-Shuo Liu, Jung-Tsan Tsai, Chien-Ping Lee | 2016-04-05 |
| 8969922 | Field effect transistors and method of forming the same | Chia-Chu Liu, Kuei-Shun Chen, Mu-Chi Chiang, Yao-Kwang Wu, Bi-Fen Wu +2 more | 2015-03-03 |
| 8367429 | Adaptive endpoint method for pad life effect on chemical mechanical polishing | Chu-An Lee, Peng-Chung Jangjian | 2013-02-05 |