Issued Patents All Time
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9768136 | Interconnect structure and method of fabricating same | Wen-Hsiung Lu, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu | 2017-09-19 |
| 9589862 | Interconnect structures and methods of forming same | Tsung-Yuan Yu, Hsien-Wei Chen, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2017-03-07 |
| 9536865 | Interconnection joints having variable volumes in package structures and methods of formation thereof | Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen +1 more | 2017-01-03 |
| 9437564 | Interconnect structure and method of fabricating same | Wen-Hsiung Lu, Cheng-Ting Chen, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2016-09-06 |
| 9431360 | Semiconductor structure and manufacturing method thereof | Yu-Peng Tsai, Wei-Hung Lin, Chun-Lung Jao, Chao-Wen Shih, Ming-Da Cheng +1 more | 2016-08-30 |
| 9368398 | Interconnect structure and method of fabricating same | Wen-Hsiung Lu, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-06-14 |
| 9355927 | Semiconductor packaging and manufacturing method thereof | Hsiu-Jen Lin, Wen-Hsiung Lu, Cheng-Ting Chen, Wei-Yu Chen, Ming-Da Cheng +1 more | 2016-05-31 |
| 9287203 | Package-on-package structure and method of forming same | Chih-Wei Lin, Wen-Hsiung Lu, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-03-15 |
| 9257333 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Tsung-Yuan Yu, Hsien-Wei Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-02-09 |