Issued Patents All Time
Showing 26–50 of 65 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424228 | Semiconductor structure and method for manufacturing the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Ching-Chun Wang | 2022-08-23 |
| 11410972 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Jen-Cheng Liu, Min-Feng Kao +3 more | 2022-08-09 |
| 11404534 | Backside capacitor techniques | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu | 2022-08-02 |
| 11387167 | Semiconductor structure and manufacturing method for the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Ching-Chun Wang, Kuan-Chieh Huang +1 more | 2022-07-12 |
| 11322481 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Jen-Cheng Liu, Min-Feng Kao +3 more | 2022-05-03 |
| 11289455 | Backside contact to improve thermal dissipation away from semiconductor devices | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Yi-Shin Chu, Ping-Tzu Chen +1 more | 2022-03-29 |
| 11282769 | Oversized via as through-substrate-via (TSV) stop layer | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Yi-Shin Chu, Ping-Tzu Chen | 2022-03-22 |
| 11222814 | Integrated circuit (IC) structure for high performance and functional density | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Kuan-Chieh Huang | 2022-01-11 |
| 11217478 | Integrated circuit (IC) structure for high performance and functional density | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Kuan-Chieh Huang | 2022-01-04 |
| 11195818 | Backside contact for thermal displacement in a multi-wafer stacked integrated circuit | Ping-Tzu Chen, Min-Feng Kao | 2021-12-07 |
| 11177302 | CMOS image sensor structure with microstructures formed on semiconductor layer | Chien Nan Tu, Yu-Lung Yeh, Chien-Chang Huang, Shih-Shiung Chen | 2021-11-16 |
| 11062977 | Shield structure for backside through substrate vias (TSVs) | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Wei-Tao Tsai | 2021-07-13 |
| 11063038 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Fu-Jier Fan, Hsiao-Chin Tuan, Jen-Cheng Liu +2 more | 2021-07-13 |
| 10964692 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Fu-Jier Fan, Hsiao-Chin Tuan, Jen-Cheng Liu +2 more | 2021-03-30 |
| 10916502 | Semiconductor device and manufacturing method thereof | Hsin-Hung Chen, Min-Feng Kao, Jen-Cheng Liu, Dun-Nian Yaung | 2021-02-09 |
| 10811398 | Semiconductor structure and method for manufacturing the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Ching-Chun Wang | 2020-10-20 |
| 10804155 | Inductor structure for integrated circuit | Shih-Han Huang, Ching-Chun Wang, Dun-Nian Yaung, Jen-Cheng Liu, Min-Feng Kao | 2020-10-13 |
| 10790194 | Inductor structure for integrated circuit | Shih-Han Huang, Ching-Chun Wang, Dun-Nian Yaung, Jen-Cheng Liu, Min-Feng Kao | 2020-09-29 |
| 10727205 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Jen-Cheng Liu, Min-Feng Kao +3 more | 2020-07-28 |
| 10727164 | Semiconductor structure and manufacturing method for the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Ching-Chun Wang, Kuan-Chieh Huang +1 more | 2020-07-28 |
| 10629592 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Fu-Jier Fan, Hsiao-Chin Tuan, Jen-Cheng Liu +2 more | 2020-04-21 |
| 10510592 | Integrated circuit (IC) structure for high performance and functional density | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Kuan-Chieh Huang | 2019-12-17 |
| 10504784 | Inductor structure for integrated circuit | Shih-Han Huang, Ching-Chun Wang, Dun-Nian Yaung, Jen-Cheng Liu, Min-Feng Kao | 2019-12-10 |
| 10163878 | Semiconductor structure and method for manufacturing the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Ching-Chun Wang | 2018-12-25 |
| 10164141 | Image sensor device with damage reduction | Chien Nan Tu, Yu-Lung Yeh, Chien-Chang Huang | 2018-12-25 |