Issued Patents All Time
Showing 26–50 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770345 | Integrated circuit and fabrication method thereof | Tai-Yen Peng, Chang-Sheng Lin, Chien-Chung Huang, Yu-Shu Chen, Sin-Yi Yang +3 more | 2020-09-08 |
| 10755974 | Interconnect structure and method of forming same | Ming-Hui Chu, Jyu-Horng Shieh | 2020-08-25 |
| 10714383 | Interconnect structure and method of forming the same | Jeng-Shiou Chen, Jyu-Horng Shieh, Minghsing Tsai | 2020-07-14 |
| 10679895 | Interconnect structure and method of forming the same | Jeng-Shiou Chen | 2020-06-09 |
| 10658184 | Pattern fidelity enhancement with directional patterning technology | Yu-Tien Shen, Chi-Cheng Hung, Chin-Hsiang Lin, Chien-Wei Wang, Ching-Yu Chang +7 more | 2020-05-19 |
| 10651373 | Memory device and fabrication method thereof | Tai-Yen Peng, Chien-Chung Huang, Yu-Shu Chen, Sin-Yi Yang, Chen-Jung Wang +3 more | 2020-05-12 |
| 10535556 | Integrated circuit with conductive line having line-ends | Jyu-Horng Shieh, Pei-Wen Huang | 2020-01-14 |
| 10522391 | Method and apparatus for back end of line semiconductor device processing | Chung-Wen Wu, Jyu-Horng Shieh | 2019-12-31 |
| 10515895 | Method of preventing pattern collapse | Chung-Wen Wu, Jeng-Shiou Chen, Jang-Shiang Tsai, Jyu-Horng Shieh | 2019-12-24 |
| 10504780 | Contact plug without seam hole and methods of forming the same | Jyu-Horng Shieh | 2019-12-10 |
| 10483397 | Fin field effect transistor and method of forming the same | Ju-Wang Hsu, Tang-Xuan Zhong, Yi-Nien Su, Jang-Shiang Tsai | 2019-11-19 |
| 10453794 | Interconnect structure for semiconductor devices | — | 2019-10-22 |
| 10354949 | Air gap structure and method | Jyu-Horng Shieh | 2019-07-16 |
| 10290538 | Interconnect structure and method of forming the same | Jeng-Shiou Chen, Jyu-Horng Shieh, Minghsing Tsai | 2019-05-14 |
| 10269632 | Semiconductor device and method | Ming-Hui Chu, Jyu-Horng Shieh | 2019-04-23 |
| 10170420 | Patterning approach for improved via landing profile | Chung-Wen Wu | 2019-01-01 |
| 10163689 | Integrated circuit with conductive line having line-ends | Jyu-Horng Shieh, Pei-Wen Huang | 2018-12-25 |
| 10157752 | Systems and methods for in SITU maintenance of a thin hardmask during an etch process | Chung-Wen Wu | 2018-12-18 |
| 10115630 | Interconnect structure and method of forming the same | Jeng-Shiou Chen | 2018-10-30 |
| 10043706 | Mitigating pattern collapse | Ya-Lien Lee, Chung-Wen Wu, Jeng-Shiou Chen | 2018-08-07 |
| 10043754 | Semiconductor device having air gap structures and method of fabricating thereof | Jyu-Horng Shieh | 2018-08-07 |
| 10002784 | Via corner engineering in trench-first dual damascene process | — | 2018-06-19 |
| 9991200 | Air gap structure and method | Jyu-Horng Shieh | 2018-06-05 |
| 9966309 | Contact plug without seam hole and methods of forming the same | Jyu-Horng Shieh | 2018-05-08 |
| 9929094 | Semiconductor device having air gap structures and method of fabricating thereof | Jyu-Horng Shieh | 2018-03-27 |