Issued Patents All Time
Showing 26–50 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056474 | Semiconductor package, semiconductor device and method of forming the same | Chen-Hua Yu, Chung-Shi Liu, Tsai-Tsung Tsai, Wei-Hung Lin, Ming-Da Cheng | 2021-07-06 |
| 11031458 | Metal-insulator-metal (MIM) capacitor structure and method for forming the same | Chih-Yang Pai, Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Hui-Chi Chen, Dian-Hau Chen +1 more | 2021-06-08 |
| 10950514 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2021-03-16 |
| 10861810 | Shielding structures | Hui-Chi Chen, Kuo-Chin Chang, Chien-Huang Yeh, Hong-Seng Shue, Dian-Hau Chen +1 more | 2020-12-08 |
| 10734474 | Metal-insulator-metal structure and methods of fabrication thereof | Hung-Chao Kao, Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Hsiang-Ku Shen, Hui-Chi Chen +2 more | 2020-08-04 |
| 10629508 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2020-04-21 |
| 10510719 | Methods of packaging semiconductor devices and packaged semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng | 2019-12-17 |
| 10510630 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2019-12-17 |
| 10510716 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng | 2019-12-17 |
| 10468478 | Metal-insulator-metal (MIM) capacitor structure and method for forming the same | Chih-Yang Pai, Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Hui-Chi Chen, Dian-Hau Chen +1 more | 2019-11-05 |
| 10283427 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2019-05-07 |
| 10269673 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2019-04-23 |
| 10163804 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng | 2018-12-25 |
| 10163734 | Method for manufacturing semiconductor structure | Chen-Hua Yu, Chun-Hung Lin, Ming-Da Cheng, Chung-Shi Liu, Mirng-Ji Lii | 2018-12-25 |
| 10157849 | Packages with molding structures and methods of forming the same | Cheng-Tar Wu, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2018-12-18 |
| 10134717 | Semiconductor package, semiconductor device and method of forming the same | Chen-Hua Yu, Chung-Shi Liu, Tsai-Tsung Tsai, Wei-Hung Lin, Ming-Da Cheng | 2018-11-20 |
| 10050000 | Bump-on-trace structures with high assembly yield | Chen-Shien Chen, Chung-Shi Liu, Ming-Da Cheng, Tin-Hao Kuo, Yi-Teh Chou | 2018-08-14 |
| 10043778 | Methods of packaging semiconductor devices and packaged semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng | 2018-08-07 |
| 10020211 | Wafer-level molding chase design | Chen-Hua Yu, Chung-Shi Liu, Hui-Min Huang, Ming-Da Cheng, Meng-Tse Chen +2 more | 2018-07-10 |
| 9911675 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2018-03-06 |
| 9911674 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2018-03-06 |
| 9887162 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng | 2018-02-06 |
| 9871018 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng | 2018-01-16 |
| 9847317 | Methods of packaging semiconductor devices and packaged semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng | 2017-12-19 |
| 9728427 | Method for manufacturing semiconductor structure | Chen-Hua Yu, Chun-Hung Lin, Ming-Da Cheng, Chung-Shi Liu, Mirng-Ji Lii | 2017-08-08 |