Issued Patents All Time
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9257331 | Method of making interconnect structure | Po-Cheng Shih, Yu-Yun Peng, Joung-Wei Liou | 2016-02-09 |
| 9236294 | Method for forming semiconductor device structure | Chung-Chi Ko, Po-Cheng Shih, Chih-Hung Sun, Kuang-Yuan Hsu, Joung-Wei Liou +1 more | 2016-01-12 |
| 9196551 | Automatically adjusting baking process for low-k dielectric material | Chung-Chi Ko, Keng-Chu Lin, Shwang-Ming Jeng | 2015-11-24 |
| 9087877 | Low-k interconnect structures with reduced RC delay | Chung-Chi Ko, Ting-Yu Shen, Keng-Chu Lin, Tien-I Bao, Shwang-Ming Jeng +1 more | 2015-07-21 |
| 9004914 | Method of and apparatus for active energy assist baking | Chung-Chi Ko, Keng-Chu Lin, Joung-Wei Liou, Shwang-Ming Jeng, Mei-Ling Chen | 2015-04-14 |
| 8993442 | Interconnect structure and method for forming the same | Po-Cheng Shih, Joung-Wei Liou, Chih-Hung Sun, Kuang-Yuan Hsu | 2015-03-31 |
| 8877083 | Surface treatment in the formation of interconnect structure | Mei-Ling Chen, Hui-Chun Yang, Po-Cheng Shih, Joung-Wei Liou, Shwang-Ming Jeng | 2014-11-04 |
| 8853831 | Interconnect structure and method for forming the same | Po-Cheng Shih, Yu-Yun Peng, Joung-Wei Liou | 2014-10-07 |
| 8846528 | Method of modifying a low k dielectric layer having etched features and the resulting product | Joung-Wei Liou, Chung-Chi Ko, Keng-Chu Lin | 2014-09-30 |
| 8629056 | Method for forming self-assembled mono-layer liner for cu/porous low-k interconnections | Chung-Chi Ko, Keng-Chu Lin, Tien-I Bao, Chen-Hua Yu | 2014-01-14 |
| 8481412 | Method of and apparatus for active energy assist baking | Chung-Chi Ko, Keng-Chu Lin, Joung-Wei Liou, Shwang-Ming Jeng, Mei-Ling Chen | 2013-07-09 |
| 8354346 | Method for fabricating low-k dielectric and Cu interconnect | Chih-Hao Chen, Ming-Chung Liang, Keng-Chu Lin, Tzu-Li Lee | 2013-01-15 |
| 8043959 | Method of forming a low-k dielectric layer with improved damage resistance and chemical integrity | Keng-Chu Iin, Ming-Ling Yeh | 2011-10-25 |
| 7998873 | Method for fabricating low-k dielectric and Cu interconnect | Chih-Hao Chen, Ming-Chung Liang, Keng-Chu Lin, Tzu-Li Lee | 2011-08-16 |
| 7968451 | Method for forming self-assembled mono-layer liner for Cu/porous low-k interconnections | Chung-Chi Ko, Keng-Chu Lin, Tien-I Bao, Chen-Hua Yu | 2011-06-28 |
| 7723226 | Interconnects containing bilayer porous low-k dielectrics using different porogen to structure former ratio | Chen-Hua Yu, Yung-Cheng Lu, Pei-Ren Jeng, Keng-Chu Lin, Chung-Chi Ko +2 more | 2010-05-25 |
| 7485949 | Semiconductor device | Chung-Chi Ko, Zhen-Cheng Wu, Keng-Chu Lin, Shwang-Ming Jeng | 2009-02-03 |
| 7466027 | Interconnect structures with surfaces roughness improving liner and methods for fabricating the same | Chung-Chi Ko, Keng-Chu Lin | 2008-12-16 |
| 7314828 | Repairing method for low-k dielectric materials | Keng-Chu Lin, Chen-Hua Yu, Ching-Ya Wang, Tien-I Bao, Shwang-Ming Cheng | 2008-01-01 |