Issued Patents All Time
Showing 101–109 of 109 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7193327 | Barrier structure for semiconductor devices | Chen-Hua Yu, Shing-Chyang Pan, Shau-Lin Shue, Ching-Hua Hsieh, Hsien-Ming Lee +1 more | 2007-03-20 |
| 7179759 | Barrier layer and fabrication method thereof | Ching-Hua Hsieh, Shau-Lin Shue | 2007-02-20 |
| 7071095 | Barrier metal re-distribution process for resistivity reduction | Ching-Hua Hsieh, Shau-Lin Shue | 2006-07-04 |
| 7030023 | Method for simultaneous degas and baking in copper damascene process | Shing-Chyang Pan, Ching-Hua Hsieh, Jing-Cheng Lin, Hsien-Ming Lee, Shau-Lin Shue | 2006-04-18 |
| 6949472 | Method for high kinetic energy plasma barrier deposition | Ching-Hua Hsieh, Shau-Lin Shue | 2005-09-27 |
| 6943111 | Barrier free copper interconnect by multi-layer copper seed | Jing-Cheng Lin, Winston Shue, Mong-Song Liang | 2005-09-13 |
| 6806192 | Method of barrier-less integration with copper alloy | Jing-Cheng Lin, Ching-Hua Hsieh, Shau-Lin Shue, Mong-Song Liang | 2004-10-19 |
| 6706629 | Barrier-free copper interconnect | Jing-Cheng Lin, Winston Shue, Mong-Song Liang | 2004-03-16 |
| 6555474 | Method of forming a protective layer included in metal filled semiconductor features | Minghsing Tsai, Winston Shue, Mong-Song Liang | 2003-04-29 |