Issued Patents All Time
Showing 176–200 of 209 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11018157 | Local interconnect structure | Chih-Liang Chen, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young, Hui-Ting Yang +5 more | 2021-05-25 |
| 10937884 | Gate spacer with air gap for semiconductor device structure and method for forming the same | Sheng-Tsung Wang, Lin-Yu Huang, Chia-Lin Chuang, Chia-Hao Chang, Yu-Ming Lin +1 more | 2021-03-02 |
| 10930595 | Standard cells having via rail and deep via structures | Wei-Cheng Lin, Chih-Liang Chen, Charles Chew-Yuen Young, Hui-Ting Yang, Wayne Lai | 2021-02-23 |
| 10923424 | Interconnect structure with air-gaps | Tai-I Yang, Yung-Chih Wang, Tien-Lu Lin | 2021-02-16 |
| 10879120 | Self aligned via and method for fabricating the same | Chih-Liang Chen, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young, Jiann-Tyng Tzeng +4 more | 2020-12-29 |
| 10847460 | Advanced metal connection with metal cut | Chih-Liang Chen, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young, Hui-Ting Yang +6 more | 2020-11-24 |
| 10818597 | Hybrid copper structure for advance interconnect usage | Hsiang-Wei Liu, Tai-I Yang, Tien-Lu Lin | 2020-10-27 |
| 10784869 | Integrated circuit and method of manufacturing the same | Shih-Wei Peng, Chih-Ming Lai, Jiann-Tyng Tzeng, Wei-Cheng Lin | 2020-09-22 |
| 10784155 | Multi-metal fill with self-align patterning | Wei-Chen Chu, Tai-I Yang, Chia-Tien Wu | 2020-09-22 |
| 10727113 | Methods of forming metal layer structures in semiconductor devices | Ethan Hsiao, Chien-Wen Lai, Chih-Ming Lai, Yi-Hsiung Lin, Hsin-Ping Chen +1 more | 2020-07-28 |
| 10700005 | Interconnect structure with air gaps | Tai-I Yang, Yung-Chih Wang, Tien-Lu Lin | 2020-06-30 |
| 10504775 | Methods of forming metal layer structures in semiconductor devices | Ethan Hsiao, Chien-Wen Lai, Chih-Ming Lai, Yi-Hsiung Lin, Hsin-Ping Chen +1 more | 2019-12-10 |
| 10483159 | Multi-metal fill with self-align patterning | Wei-Chen Chu, Tai-I Yang, Chia-Tien Wu | 2019-11-19 |
| 10468349 | Advanced metal connection with metal cut | Chih-Liang Chen, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young, Hui-Ting Yang +6 more | 2019-11-05 |
| 10290580 | Hybrid copper structure for advance interconnect usage | Hsiang-Wei Liu, Tai-I Yang, Tien-Lu Lin | 2019-05-14 |
| 10276498 | Interconnect structure with air-gaps | Tai-I Yang, Yung-Chih Wang, Tien-Lu Lin | 2019-04-30 |
| 10109519 | Method of semiconductor integrated circuit fabrication | Hsiang-Lun Kao, Tien-Lu Lin, Yung-Chih Wang | 2018-10-23 |
| 10109582 | Advanced metal connection with metal cut | Chih-Liang Chen, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young, Hui-Ting Yang +6 more | 2018-10-23 |
| 10103102 | Structure and formation method of semiconductor device structure | Jian-Hua Chen, Tai-I Yang, Chia-Tien Wu, Tien-Lu Lin, Tien-I Bao | 2018-10-16 |
| 10049956 | Passivation structure and method of making the same | Hsuan-Hui Hung, Kun-Ming Huang, Ming-Yi Lin | 2018-08-14 |
| 10026647 | Multi-metal fill with self-align patterning | Wei-Chen Chu, Tai-I Yang, Chia-Tien Wu | 2018-07-17 |
| 9875967 | Interconnect structure with air-gaps | Tai-I Yang, Yung-Chih Wang, Tien-Lu Lin | 2018-01-23 |
| 9865539 | Structure and formation method of semiconductor device structure | Jian-Hua Chen, Tai-I Yang, Chia-Tien Wu, Tien-Lu Lin, Tien-I Bao | 2018-01-09 |
| 9837354 | Hybrid copper structure for advance interconnect usage | Hsiang-Wei Liu, Tai-I Yang, Tien-Lu Lin | 2017-12-05 |
| 9761504 | Passivation structure and method of making the same | Kun-Ming Huang, Hsuan-Hui Hung, Ming-Yi Lin | 2017-09-12 |