Issued Patents All Time
Showing 126–150 of 209 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532713 | Source/drain contacts and methods of forming same | Li-Zhen Yu, Huan-Chieh Su, Lin-Yu Huang, Chih-Hao Wang | 2022-12-20 |
| 11532703 | Semiconductor device and method | Huan-Chieh Su, Shang-Wen Chang, Yi-Hsun Chiu, Pei-Yu Wang, Ching-Wei Tsai +1 more | 2022-12-20 |
| 11532556 | Structure and method for transistors having backside power rails | Yu-Xuan Huang, Ching-Wei Tsai, Cheng-Ting Chung, Shang-Wen Chang | 2022-12-20 |
| 11527609 | Increasing device density and reducing cross-talk spacer structures | Huan-Chieh Su, Chia-Hao Chang, Chih-Hao Wang, Yu-Ming Lin | 2022-12-13 |
| 11508615 | Semiconductor device structure and methods of forming the same | Lin-Yu Huang, Li-Zhen Yu, Chia-Hao Chang, Kuan-Lun Cheng, Chih-Hao Wang | 2022-11-22 |
| 11502201 | Semiconductor device with backside power rail and methods of fabrication thereof | Li-Zhen Yu, Huan-Chieh Su, Shih-Chuan Chiu, Lin-Yu Huang, Chih-Hao Wang | 2022-11-15 |
| 11495539 | Interconnect structure with air-gaps | Tai-I Yang, Yung-Chih Wang, Tien-Lu Lin | 2022-11-08 |
| 11495491 | Structure and formation method of semiconductor device with stacked conductive structures | Chun-Yuan Chen, Chia-Hao Chang, Yu-Ming Lin, Chih-Hao Wang | 2022-11-08 |
| 11482595 | Dual side contact structures in semiconductor devices | Shih-Chuan Chiu, Chia-Hao Chang, Chih-Hao Wang, Huan-Chieh Su, Chun-Yuan Chen +2 more | 2022-10-25 |
| 11482594 | Semiconductor devices with backside power rail and method thereof | Li-Zhen Yu, Huan-Chieh Su, Lin-Yu Huang, Chih-Hao Wang | 2022-10-25 |
| 11456246 | Semiconductor device structure and methods of forming the same | Lin-Yu Huang, Li-Zhen Yu, Chia-Hao Chang, Kuan-Lun Cheng, Chih-Hao Wang | 2022-09-27 |
| 11456209 | Spacers for semiconductor devices including a backside power rails | Li-Zhen Yu, Huan-Chieh Su, Lin-Yu Huang, Chih-Hao Wang | 2022-09-27 |
| 11450751 | Integrated circuit structure with backside via rail | Huan-Chieh Su, Li-Zhen Yu, Chun-Yuan Chen, Shang-Wen Chang, Yi-Hsun Chiu +3 more | 2022-09-20 |
| 11444018 | Semiconductor device including recessed interconnect structure | Guo-Huei Wu, Hui-Zhong Zhuang, Chih-Liang Chen, Shang-Wen Chang, Yi-Hsun Chiu | 2022-09-13 |
| 11443987 | Semiconductor devices with backside air gap dielectric | Chun-Yuan Chen, Huan-Chieh Su, Yu-Ming Lin, Chih-Hao Wang | 2022-09-13 |
| 11437279 | Method for fabricating a semiconductor device | Chun-Yuan Chen, Li-Zhen Yu, Huan-Chieh Su, Lo-Heng Chang, Chih-Hao Wang | 2022-09-06 |
| 11430789 | Semiconductor devices with backside contacts and isolation | Chun-Yuan Chen, Huan-Chieh Su, Chih-Hao Wang | 2022-08-30 |
| 11410876 | Semiconductor device with air gaps and method of fabrication thereof | Chia-Hao Chang, Lin-Yu Huang, Li-Zhen Yu, Kuan-Lun Cheng, Chih-Hao Wang | 2022-08-09 |
| 11404548 | Capacitance reduction for backside power rail device | Li-Zhen Yu, Chih-Hao Wang, Huan-Chieh Su, Lin-Yu Huang | 2022-08-02 |
| 11387233 | Semiconductor device structure and methods of forming the same | Huan-Chieh Su, Chun-Yuan Chen, Pei-Yu Wang, Chih-Hao Wang | 2022-07-12 |
| 11387140 | Enlarging contact area and process window for a contact via | Li-Zhen Yu, Chih-Hao Wang, Yu-Ming Lin, Lin-Yu Huang | 2022-07-12 |
| 11374093 | Semiconductor device structure and methods of forming the same | Lin-Yu Huang, Li-Zhen Yu, Kuan-Lun Cheng, Chih-Hao Wang | 2022-06-28 |
| 11361986 | Using a liner layer to enlarge process window for a contact via | Li-Zhen Yu, Chih-Hao Wang, Yu-Ming Lin, Lin-Yu Huang | 2022-06-14 |
| 11355601 | Semiconductor devices with backside power rail and backside self-aligned via | Kuo-Cheng Chiang, Shi Ning Ju, Kuan-Lun Cheng, Chih-Hao Wang | 2022-06-07 |
| 11349004 | Backside vias in semiconductor device | Li-Zhen Yu, Huan-Chieh Su, Lin-Yu Huang, Chih-Hao Wang | 2022-05-31 |