Issued Patents All Time
Showing 26–41 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7180007 | Electronic circuit device and its manufacturing method | Kazuhiro Nishikawa, Masayuki Okano | 2007-02-20 |
| 7176055 | Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component | Daisuke Sakurai | 2007-02-13 |
| 7090482 | Semiconductor device package manufacturing method and semiconductor device package manufactured by the method | Takashi Akiguchi, Hidenori Miyakawa | 2006-08-15 |
| 7084008 | Manufacturing method for electronic component-mounted component, manufacturing method for electronic component-mounted completed product with the electronic component-mounted component, and electronic component-mounted completed product | Daisuke Sakurai | 2006-08-01 |
| 7071090 | Semiconductor element having protruded bump electrodes | Kazushi Higashi, Takahiro Yonezawa, Yoshihiko Yagi, Yoshifumi Kitayama, Hiroyuki Otani | 2006-07-04 |
| 6971167 | Multilayered circuit board forming method and multilayered circuit board | Kazuhiro Nishikawa, Hiroyuki Otani | 2005-12-06 |
| 6894387 | Semiconductor element having protruded bump electrodes | Kazushi Higashi, Takahiro Yonezawa, Yoshihiko Yagi, Yoshifumi Kitayama, Hiroyuki Otani | 2005-05-17 |
| 6825055 | Method for assembling integral type electronic component and integral type electronic component | Kazushi Higashi, Hiroyuki Otani | 2004-11-30 |
| 6780668 | Package of semiconductor device and method of manufacture thereof | Takashi Akiguchi, Hidenori Miyakawa | 2004-08-24 |
| 6531022 | Mounting method of semiconductor element | — | 2003-03-11 |
| 6357106 | Method for mounting parts and making an IC card | Mitsumasa Oku, Takashi Akiguchi, Shinji Murakami, Yutaka Harada, Mitsunori Yokomakura +1 more | 2002-03-19 |
| 6232211 | Two-step projecting bump for semiconductor chip and method for forming the same | — | 2001-05-15 |
| 6207549 | Method of forming a ball bond using a bonding capillary | Kazushi Higashi, Takahiro Yonezawa, Yoshihiko Yagi, Yoshifumi Kitayama, Hiroyuki Otani | 2001-03-27 |
| 6051093 | Mounting method of semiconductor element | — | 2000-04-18 |
| 5917156 | Circuit board having electrodes and pre-deposit solder receiver | Kazuhiro Nobori, Kazuto Nishida | 1999-06-29 |
| 5686353 | Semiconductor device and manufacturing method thereof | Yoshihiko Yagi, Kazushi Higashi, Koichi Kumagai, Takahiro Yonezawa | 1997-11-11 |