Issued Patents All Time
Showing 101–111 of 111 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8574964 | Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tape | SungWon Cho, DaeSik Choi, KyuWon Lee | 2013-11-05 |
| 8502387 | Integrated circuit packaging system with vertical interconnection and method of manufacture thereof | DaeSik Choi, KyuWon Lee, SungWon Cho | 2013-08-06 |
| 8390110 | Integrated circuit packaging system with cavity and method of manufacture thereof | Sang Ho Lee, Soo-San Park | 2013-03-05 |
| 8258008 | Package-on-package system with via z-interconnections and method for manufacturing thereof | Sang Ho Lee, SeungYun Ahn | 2012-09-04 |
| 8115293 | Integrated circuit packaging system with interconnect and method of manufacture thereof | DongSoo Moon, Soo-San Park, SooMoon Park, Sang Ho Lee | 2012-02-14 |
| 8030769 | Grooving bumped wafer pre-underfill system | Junghoon Shin, Sungyoon Lee | 2011-10-04 |
| 8017502 | Wafer system with partial cuts | Sang Ho Lee | 2011-09-13 |
| 7863755 | Package-on-package system with via Z-interconnections | Sang Ho Lee, SeungYun Ahn | 2011-01-04 |
| 7786551 | Integrated circuit system with wafer trimming | Seung Wook Park, Sung Yoon Lee | 2010-08-31 |
| 7727875 | Grooving bumped wafer pre-underfill system | Junghoon Shin, Sungyoon Lee | 2010-06-01 |
| 7659140 | Integrated circuit system with a debris trapping system | Sang Ho Lee, BoHan Yoon | 2010-02-09 |