Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10888959 | Cu core ball, solder joint, solder paste and formed solder | Shigeki Kondoh, Hiroki Sudo, Masato Tsuchiya, Takashi Yashima, Takahiro Roppongi +1 more | 2021-01-12 |
| 10857630 | Flux and solder paste | Yoshinori Takagi, Takahiro Nishizaki | 2020-12-08 |
| 10843298 | Flux and solder paste | Masato Shiratori, Takahiro Nishizaki, Tomohisa Kawanago | 2020-11-24 |
| 10811376 | Cu column, Cu core column, solder joint, and through-silicon via | Takahiro Roppongi, Daisuke Soma, Isamu Sato, Yuji Kawamata | 2020-10-20 |
| 10780531 | Solder ball, solder joint, and joining method | Yuri Nakamura, Osamu Munekata, Kaichi Tsuruta | 2020-09-22 |
| 10717157 | Solder material, solder paste, solder preform, solder joint and method of managing the solder material | Takahiro Hattori, Hiroshi Okada, Takahiro Roppongi, Daisuke Soma, Isamu Sato | 2020-07-21 |
| 10688603 | Flux for resin flux cored solder, flux for flux coated solder, resin flux cored solder, and flux coated solder | Motohiro Onitsuka, Yoko Kurasawa, Toshihisa Kugi | 2020-06-23 |
| 10675719 | Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint | Shigeki Kondo, Atsushi Ikeda, Takahiro Roppongi, Takashi Hagiwara, Daisuke Soma +3 more | 2020-06-09 |
| 10639749 | Cu core ball, solder joint, solder paste and formed solder | Shigeki Kondoh, Hiroki Sudo, Masato Tsuchiya, Takashi Yashima, Takahiro Roppongi +1 more | 2020-05-05 |
| 10610979 | Flux composition for solder applications | Daisuke Maruko, Atsumi Takahashi, Hiroki Sudo, Takahiro Hattori, Takahiro Roppongi +4 more | 2020-04-07 |
| 10583533 | Flux | Daisuke Maruko, Atsumi Takahashi | 2020-03-10 |
| 10556299 | Flux and resin composition for flux | Hiroyuki Yamasaki, Takashi Hagiwara | 2020-02-11 |
| 10381319 | Core material, semiconductor package, and forming method of bump electrode | Tomoaki Nishino, Shigeki Kondo, Takahiro Hattori, Takahiro Roppongi, Daisuke Soma +1 more | 2019-08-13 |
| 10370771 | Method of manufacturing cu core ball | Takahiro Roppongi, Daisuke Soma, Isamu Sato | 2019-08-06 |
| 10357852 | Flux with dibasic acid mixture | Yasuhiro Kajikawa, Yoshinori Hiraoka, Takashi Hagiwara | 2019-07-23 |
| 10173287 | Solder material, solder joint, and method of manufacturing the solder material | Takahiro Roppongi, Daisuke Soma, Isamu Sato, Yuji Kawamata | 2019-01-08 |
| 10150185 | Method for producing metal ball, joining material, and metal ball | Takahiro Roppongi, Daisuke Soma, Isamu Sato | 2018-12-11 |
| 10147695 | Cu core ball | Tomohiko Hashimoto, Atsushi Ikeda, Takahiro Roppongi, Daisuke Soma, Isamu Sato +1 more | 2018-12-04 |
| 10137535 | Cu ball, Cu core ball, solder joint, solder paste, and solder foam | Takahiro Roppongi, Daisuke Soma, Isamu Sato | 2018-11-27 |
| 9816160 | Ni ball, Ni nuclear ball, solder joint, foam solder and solder paste | Ryoichi Kurata, Takashi Akagawa | 2017-11-14 |
| 9802251 | Ni ball, Ni core ball, solder joint, solder paste, and solder foam | Takashi Akagawa, Yuichi Koikeda, Atsushi Ikeda, Masaru Sasaki, Takahiro Roppongi +2 more | 2017-10-31 |
| 9668358 | Cu ball | Takahiro Hattori, Takahiro Roppongi, Daisuke Soma, Isamu Sato | 2017-05-30 |
| 9278409 | Core ball, solder paste, formed-solder, flux-coated core ball and solder joint | Shigeki Kondo, Atsushi Ikeda, Takahiro Roppongi, Daisuke Soma, Isamu Sato | 2016-03-08 |
| 9266196 | Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste | Takashi Akagawa, Kazuhiko Matsui, Yuichi Koikeda, Masaru Sasaki, Hiroyuki Yamasaki +3 more | 2016-02-23 |
| 4645277 | Connector for connecting boards | Hiroshi Kikuchi, Minoru Teshima, Hideaki Ishimizu | 1987-02-24 |