SY

Sung Jin Yang

Samsung: 41 patents #2,580 of 75,807Top 4%
DE Dongbu Daewoo Electronics: 26 patents #2 of 74Top 3%
AT Amkor Technology: 8 patents #84 of 595Top 15%
CC Cmtech Co.: 6 patents #1 of 7Top 15%
HM Hyundai Motor: 3 patents #3,336 of 11,886Top 30%
HW Hyundai Wia: 3 patents #20 of 92Top 25%
AP Amkor Technology Singapore Holding Pte.: 1 patents #236 of 289Top 85%
DE Daewoo Electronics: 1 patents #304 of 680Top 45%
NC Nongshim Co.: 1 patents #8 of 35Top 25%
AH Ahnlab: 1 patents #9 of 30Top 30%
Overall (All Time): #17,827 of 4,157,543Top 1%
90
Patents All Time

Issued Patents All Time

Showing 76–90 of 90 patents

Patent #TitleCo-InventorsDate
9721872 Methods and structures for increasing the allowable die size in TMV packages Louis W. Nicholls, Roger D. St. Amand, Jin Seong Kim, Woon Kab Jung, Robert Francis Darveaux 2017-08-01
9709321 Refrigerator and method of replacing water tank for refrigerator 2017-07-18
9689275 Variable geometry turbo system Kyung-Jae Jung, Seung Yeon Lee, Kwang-Hwan Kim, Gil-Beom Lee, Jun Gwan Park +2 more 2017-06-27
9593877 Refrigerator having locking device for ice bucket and method for installation of locking device of ice bucket 2017-03-14
9464639 Turbo charger having cooling structure Seung Yeon Lee, Kwang-Hwan Kim, Kyung-Wook Jin, Ui Yeon Park, Jun Gwan Park +2 more 2016-10-11
9376930 Waste gate valve Kwang-Hwan Kim, Seung Yeon Lee, Dong Ho Chu, Ui Yeon Park, Kyung-Wook Jin +3 more 2016-06-28
9115912 Fluid heating device Hung Sik Min, Young Geun An 2015-08-25
8549631 Internet site security system and method thereto Ho Woong Lee, Sang Min Chung 2013-10-01
8128884 Plasma reactor Hung Sik Min, Young Geun An 2012-03-06
7982298 Package in package semiconductor device Dae Byoung Kang, Jung Tae Ok, Jae Dong Kim 2011-07-19
7214326 Increased capacity leadframe and semiconductor package using the same Doo Hwan Moon, Won Dai Shin 2007-05-08
7211879 Semiconductor package with chamfered corners and method of manufacturing the same Sun Ho Ha, Ki-Ho Kim, Sun Jin Son 2007-05-01
7144517 Manufacturing method for leadframe and for semiconductor package using the leadframe Doo Hwan Moon 2006-12-05
6428641 Method for laminating circuit pattern tape on semiconductor wafer Ju Hoon Yoon, Woo-Hyun Kong, Chang-Bok Lee 2002-08-06
5206048 Process for manufacturing potato chips Zae I. Shin, Hyung-Jae Lee, Un Soon Lee 1993-04-27