Issued Patents All Time
Showing 26–50 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8873245 | Embedded chip-on-chip package and package-on-package comprising same | Yong Hoon Kim | 2014-10-28 |
| 8664751 | Semiconductor package | Yong Hoon Kim, Jin Jeong | 2014-03-04 |
| 8647976 | Semiconductor package having test pads on top and bottom substrate surfaces and method of testing same | Eun-Seok Song, Dong-Han Kim | 2014-02-11 |
| 8587096 | Semiconductor device including shielding layer and fabrication method thereof | Yong Hoon Kim, Jin Jeong, Ji Hyun Lee | 2013-11-19 |
| 8552521 | Semiconductor package to remove power noise using ground impedance | Eun-Seok Song, Sung-Woo Park | 2013-10-08 |
| 8502084 | Semiconductor package including power ball matrix and power ring having improved power integrity | Eun-Seok Song, Hyun Ah Kim, So-Young Lim | 2013-08-06 |
| 8466554 | Electronic device having interconnections, openings, and pads having greater width than the openings | Ji-Yong Park, Chul Woo Kim, Sang-Gui Jo, Kwang-Jin Bae, Seung Hwan Kim | 2013-06-18 |
| 8445996 | Semiconductor package | Yong Hoon Kim, Yun-Seok Choi | 2013-05-21 |
| 8299597 | Semiconductor chip, wiring substrate of a semiconductor package, semiconductor package having the semiconductor chip and display device having the semiconductor package | Yun-Seok Choi | 2012-10-30 |
| 8253228 | Package on package structure | Yong Hoon Kim, Byeong-Yeon Cho | 2012-08-28 |
| 8120024 | Semiconductor package having test pads on top and bottom substrate surfaces and method of testing same | Eun-Seok Song, Dong-Han Kim | 2012-02-21 |
| 8106425 | Interconnection substrate, semiconductor chip package including the same, and display system including the same | Yun-Seok Choi, Na-Rae Shin | 2012-01-31 |
| 7956452 | Flip chip packages | Yun-Seok Choi, Kyoung-Sei Choi | 2011-06-07 |
| 7936232 | Substrate for semiconductor package | Eun-Seok Song, So-Young Lim | 2011-05-03 |
| 7868462 | Semiconductor package including transformer or antenna | Yun-Seok Choi | 2011-01-11 |
| 7826551 | Input and output driver circuits for differential signal transfer, and differential signal transfer apparatus and methods | Sung-hwan Min | 2010-11-02 |
| 7768103 | Tape distribution substrate having pattern for reducing EMI | Young-Sang Cho | 2010-08-03 |
| 7760044 | Substrate for semiconductor package | Eun-Seok Song, So-Young Lim | 2010-07-20 |
| 7705433 | Semiconductor package preventing generation of static electricity therein | Yun-Seok Choi, Eun-Seok Song | 2010-04-27 |
| 7663221 | Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same | Kyung-Lae Jang | 2010-02-16 |
| 7566954 | Bonding configurations for lead-frame-based and substrate-based semiconductor packages | Kyung-Lae Jang, Heung-Kyu Kwon | 2009-07-28 |
| 7508680 | Adjustable-inductance filter, tape distribution substrate comprising the filter, and display panel assembly comprising the tape distribution substrate | Yun-Seok Choi, Eun-Seok Song, Young-Sang Cho, Na-Rae Shin | 2009-03-24 |
| 7489035 | Integrated circuit chip package having a ring-shaped silicon decoupling capacitor | Eun-Seok Song | 2009-02-10 |
| 7374969 | Semiconductor package with conductive molding compound and manufacturing method thereof | Byeong-Yeon Cho, Kyung-Lae Jang | 2008-05-20 |
| 7372139 | Semiconductor chip package | Kyung-Lae Jang | 2008-05-13 |