HL

Hee-Seok Lee

Samsung: 42 patents #2,483 of 75,807Top 4%
QU Qualcomm: 9 patents #2,205 of 12,104Top 20%
📍 Yongin-si, KR: #304 of 9,683 inventorsTop 4%
Overall (All Time): #49,023 of 4,157,543Top 2%
53
Patents All Time

Issued Patents All Time

Showing 51–53 of 53 patents

Patent #TitleCo-InventorsDate
7372148 Semiconductor chip having coolant path, semiconductor package and package cooling system using the same Yun-Hyeok Im, Jae-Wook Yoo 2008-05-13
7330084 Printed circuit board having a bond wire shield structure for a signal transmission line Kyung-Lae Jang, Tae-Je Cho, Ki-Won Choi 2008-02-12
7327020 Multi-chip package including at least one semiconductor device enclosed therein Heung-Kyu Kwon 2008-02-05