Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermal methods for cleaning post-CMP wafers

Thermal methods for cleaning post-CMP wafers

US Patent 7884017 · Granted Feb 8, 2011

Estimated economic value: $10,777,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fining molten material using reduced pressure2025
High temperature and low pressure fining of submerged combustion or other glass2025
Systems and methods for tuning a MHz RF generator within a cycle of operation of2025
Isotropic silicon nitride removal2025
Zincating and doping of metal liner for liner passivation and adhesion improveme2024
Method for preparing graphene-coated powder material, and product of method2024
Systems and methods for tuning a MHz RF generator within a cycle of operation of2024
Metal liner passivation and adhesion enhancement by zinc doping2022
Electrochemical doping of thin metal layers employing underpotential deposition 2022
Systems and methods for reducing power reflected towards a higher frequency RF g2021
Systems and methods for tuning an impedance matching network in a step-wise fash2020
Feedback control system for iterative etch process2020