Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Conformal nanolaminate dielectric deposition and etch bag gap fill process

Conformal nanolaminate dielectric deposition and etch bag gap fill process

US Patent 7482247 · Granted Jan 27, 2009

Estimated economic value: $5,751,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Composition and device for preventing hypoglycemia and use thereof2025
Smooth titanium nitride layers and methods of forming the same2025
Conformal titanium silicon nitride-based thin films and methods of forming same2025
Conformal titanium silicon nitride-based thin films and methods of forming same2025
Conformal and smooth titanium nitride layers and methods of forming the same2025
Conformal and smooth titanium nitride layers and methods of forming the same2025
Conformal and smooth titanium nitride layers and methods of forming the same2025
Gapfill of variable aspect ratio features with a composite PEALD and PECVD metho2025
Conformal titanium nitride-based thin films and methods of forming same2024
Selective processing with etch residue-based inhibitors2024
Food components having high protein content2024
Selective processing with etch residue-based inhibitors2023