Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates

Assignee

• IBM

Inventors

• Farid Youssif Aoude (5 patents)
• Emanuel I. Cooper (72 patents)
• Peter Richard Duncombe (17 patents)
• Shaji Farooq (40 patents)
• Edward A. Giess (6 patents)
• Young-Ho Kim (317 patents)
• Sarah H. Knickerbocker (39 patents)
• Friedel Muller-Landau (2 patents)
• Mark Neisser (37 patents)
• Jae Man Park (56 patents)
• Robert R. Shaw (11 patents)
• Robert A. Rita (32 patents)
• Thomas M. Shaw (88 patents)
• Rao V. Vallabhaneni (27 patents)
• Jon A. Van Hise (2 patents)
• George F. Walker (85 patents)
• Jungihl Kim (13 patents)
• James M. Brownlow (7 patents)

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