FM

Friedel Muller-Landau

IBM: 2 patents #32,839 of 70,183Top 50%
📍 Putnam Valley, NY: #62 of 118 inventorsTop 55%
🗺 New York: #48,759 of 115,490 inventorsTop 45%
Overall (All Time): #2,291,883 of 4,157,543Top 60%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
5337475 Process for producing ceramic circuit structures having conductive vias Farid Youssif Aoude, Emanuel I. Cooper, Peter Richard Duncombe, Shaji Farooq, Edward A. Giess +12 more 1994-08-16
5283104 Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates Farid Youssif Aoude, Emanuel I. Cooper, Peter Richard Duncombe, Shaji Farooq, Edward A. Giess +12 more 1994-02-01