Spray system for slurry reduction during chemical mechanical polishing (cmp)

Assignee

• Applied Materials

Inventors

• Chih Chung Chou (30 patents)
• Anand N. Iyer (11 patents)
• Ekaterina A. Mikhaylichenko (14 patents)
• Christopher Heung-Gyun Lee (10 patents)
• Erik S. Rondum (13 patents)
• Tiffany Yu-Nung Cheung (1 patents)
• Shou-Sung Chang (64 patents)

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