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Home › Spatial wafer processing with improved temperature uniformity

Spatial wafer processing with improved temperature uniformity

US Patent 11479855 · Granted Oct 25, 2022

Estimated economic value: $42,554,000 ⓘ

Assignee

Applied Materials

Inventors

Joseph AuBuchon (41 patents)
Sanjeev Baluja (104 patents)
Dhritiman Subha Kashyap (21 patents)
Jared Ahmad Lee (37 patents)
Tejas Ulavi (24 patents)
Michael R. Rice (217 patents)

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