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Home › Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management

Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management

US Patent 10529645 · Granted Jan 7, 2020

Estimated economic value: $31,713,000 ⓘ

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