Issued Patents All Time
Showing 26–50 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7797822 | Electronic component mounting method | Hideki Eifuku, Teruaki Nishinaka | 2010-09-21 |
| 7793413 | Method of mounting electronic components | Hideki Eifuku | 2010-09-14 |
| 7632710 | Method for soldering electronic component and soldering structure of electronic component | Tadashi Maeda, Mitsuru Ozono | 2009-12-15 |
| 7568610 | Method of soldering electronic component having solder bumps to substrate | Tadashi Maeda | 2009-08-04 |
| 7446423 | Semiconductor device and method for assembling the same | Mitsuru Ozono, Yoshiyuki Wada | 2008-11-04 |
| 7284686 | Mounting method of bump-equipped electronic component and mounting structure of the same | Takstoshi Ishikawa, Makoto Okazaki | 2007-10-23 |
| 7071577 | Semiconductor device and resin binder for assembling semiconductor device | Yoshiyuki Wada | 2006-07-04 |
| 6852572 | Method of manufacturing semiconductor device | Hiroshi Haji, Shoji Sakemi, Mitsuru Ozono, Kiyoshi Arita | 2005-02-08 |
| 6797544 | Semiconductor device, method of manufacturing the device and method of mounting the device | Mitsuru Ozono, Tadashi Maeda | 2004-09-28 |
| 6617675 | Semiconductor device and semiconductor device assembly | Mitsuru Ozono, Shoji Sakemi, Yoshiyuki Wada | 2003-09-09 |
| 6536105 | Method for mounting conductive balls on a substrate | Shoji Sakemi, Kazuhiro Noda | 2003-03-25 |
| 6390351 | Apparatus and method of transferring conductive balls and apparatus and method of supplying conductive balls | Teruaki Kasai, Shinji Sasaguri, Kenichi Takakura, Kazuo Arikado | 2002-05-21 |
| 6209196 | Method of mounting bumped electronic components | Mitsuru Ozono, Hideki Eifuku | 2001-04-03 |
| 6189771 | Method of forming solder bump and method of mounting the same | Tadashi Maeda | 2001-02-20 |
| 6179198 | Method of soldering bumped work by partially penetrating the oxide film covering the solder bumps | Hideki Eifuku, Mitsuru Ozono, Shoji Sakemi | 2001-01-30 |
| 6109509 | Method of securely mounting conductive balls | Shoji Sakemi | 2000-08-29 |
| 6065201 | Method of transferring conductive balls onto work piece | — | 2000-05-23 |
| 6000127 | Electronic parts mounting method | Hideki Eifuku | 1999-12-14 |
| 5962925 | Mounting structure of electronic component having bumps | Hideki Eifuku | 1999-10-05 |
| 5894984 | Structure of electronic parts and method of soldering electronic parts to substrate | Shoji Sakemi, Teruaki Nishinaka | 1999-04-20 |
| 5890283 | Apparatus and method for mounting electrically conductive balls | Shoji Sakemi | 1999-04-06 |
| 5867260 | Conductive ball mounting apparatus and mounting method of conductive ball | — | 1999-02-02 |
| 5802712 | Electronic device mounting method | Shoji Sakemi | 1998-09-08 |
| 5741597 | Bond for tacking an electronic part | Shinichi Kuroki | 1998-04-21 |
| 5692669 | Printed circuit board | Shouzi Sakemi | 1997-12-02 |