Issued Patents All Time
Showing 51–55 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5657528 | Method of transferring conductive balls | Shoji Sakemi | 1997-08-19 |
| 5534127 | Method of forming solder bumps on electrodes of electronic component | — | 1996-07-09 |
| 5516032 | Method for forming bump electrode | Shoji Sakemi | 1996-05-14 |
| 5447267 | Method of soldering electronic part using a bond for tacking the electronic part | Shinichi Kuroki | 1995-09-05 |
| 5428505 | Printed circuit board | Shouzi Sakemi | 1995-06-27 |