Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7047632 | Method of mounting electronic components | — | 2006-05-23 |
| 6390351 | Apparatus and method of transferring conductive balls and apparatus and method of supplying conductive balls | Teruaki Kasai, Shinji Sasaguri, Kenichi Takakura, Tadahiko Sakai | 2002-05-21 |
| 6237219 | Method of mounting conductive ball | Teruaki Kasai, Shinji Sasaguri, Norifumi Eguchi | 2001-05-29 |
| 6099681 | Mounting apparatus for mounting small balls and mounting method thereof | Shinichi Nakazato | 2000-08-08 |
| 6041996 | Method of pressure bonding a bumped electronic part and an apparatus for pressure bonding a bumped electronic part | — | 2000-03-28 |
| 5443200 | Bonding apparatus and bonding method | — | 1995-08-22 |