Issued Patents All Time
Showing 51–75 of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9883588 | Oriented copper plate, copper-clad laminate, flexible circuit board, and electronic device | Keiichi Kimura, Kazuaki Kaneko | 2018-01-30 |
| 9812421 | Bonding wire for semiconductor devices | Yoshiaki Hagiwara, Tetsuya OYAMADA, Daizo Oda | 2017-11-07 |
| 9773748 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Ryo OISHI | 2017-09-26 |
| 9543266 | Bonding wire for semiconductor device use and method of production of same | Takashi Yamada, Daizo Oda, Ryo OISHI, Teruo Haibara | 2017-01-10 |
| 9536854 | Bonding wire for semiconductor device use and method of production of same | Takashi Yamada, Daizo Oda, Ryo OISHI, Teruo Haibara | 2017-01-03 |
| 9515664 | Oscillator, electronic apparatus, and moving object | Takemi Yonezawa | 2016-12-06 |
| 9427830 | Copper alloy bonding wire for semiconductor | Shinichi Terashima, Takashi Yamada, Daizo Oda | 2016-08-30 |
| 9331049 | Bonding structure of bonding wire | Takashi Yamada, Atsuo Ikeda | 2016-05-03 |
| 9112059 | Bonding wire for semiconductor device | Keiichi Kimura, Shinichi Terashima, Takashi Yamada, Akihito Nishibayashi | 2015-08-18 |
| 8836147 | Bonding structure of multilayer copper bonding wire | Takashi Yamada, Atsuo Ikeda | 2014-09-16 |
| 8815019 | Bonding wire for semiconductor | Shinichi Terashima, Takashi Yamada, Ryo OISHI, Daizo Oda | 2014-08-26 |
| 8742258 | Bonding wire for semiconductor | Shinichi Terashima, Takashi Yamada, Daizo Oda | 2014-06-03 |
| 8653668 | Copper bonding wire for semiconductor device and bonding structure thereof | Takashi Yamada, Atsuo Ikeda | 2014-02-18 |
| 8610291 | Copper alloy bonding wire for semiconductor device | Keiichi Kimura, Takashi Yamada | 2013-12-17 |
| 8415797 | Gold wire for semiconductor element connection | Keiichi Kimura, Takashi Yamada, Kagehito Nishibayashi | 2013-04-09 |
| 8389860 | Bonding wire for semiconductor devices | Keiichi Kimura, Takashi Yamada | 2013-03-05 |
| 8299356 | Bonding wire for semiconductor devices | Keiichi Kimura, Takashi Yamada | 2012-10-30 |
| 8247911 | Wire bonding structure and method for forming same | Shinichi Terashima, Keiichi Kimura, Takashi Yamada, Akihito Nishibayashi | 2012-08-21 |
| 8102061 | Semiconductor device bonding wire and wire bonding method | Keiichi Kimura, Shinichi Terashima, Takashi Yamada, Akihito Nishibayashi | 2012-01-24 |
| 8097960 | Semiconductor mounting bonding wire | Shinichi Terashima, Kohei Tatsumi, Takashi Yamada, Atsuo Ikeda, Daizo Oda | 2012-01-17 |
| 8004094 | Copper alloy bonding wire for semiconductor device | Keiichi Kimura, Takashi Yamada | 2011-08-23 |
| 7969021 | Bonding wire for semiconductor device and method for producing the same | Shinichi Terashima, Kohei Tatsumi | 2011-06-28 |
| 7952028 | Bonding wire for semiconductor device | Keiichi Kimura, Takashi Yamada | 2011-05-31 |
| 7830008 | Gold wire for connecting semiconductor chip | Keiichi Kimura | 2010-11-09 |
| 7820913 | Bonding wire for semiconductor device | Yukihiro Yamamoto | 2010-10-26 |