Issued Patents All Time
Showing 76–82 of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7741176 | Method for fabricating a cylindrical capacitor including implanting impurities into the upper sections of the lower electrode to prevent the formation of hemispherical grain silicon on the upper sections | Yoshitaka Nakamura | 2010-06-22 |
| 7390370 | Gold bonding wires for semiconductor devices and method of producing the wires | Shinichi Terashima, Kohei Tatsumi | 2008-06-24 |
| 6210637 | Gold alloy thin wire for semiconductor devices | Kohei Tatsumi | 2001-04-03 |
| 6080492 | Gold alloy thin wire for semiconductor devices | Kohei Tatsumi | 2000-06-27 |
| 5761779 | Method of producing fine metal spheres of uniform size | Tadakatsu Maruyama, Osamu Kitamura, Yasuhide Ohno, Tosiharu Kikuchi, Yasuhiro Suzuki +1 more | 1998-06-09 |
| 5658664 | Thin gold-alloy wire for semiconductor device | Osamu Kitamura, Yasuhide Ohno | 1997-08-19 |
| 5114878 | Method of bonding bumps to leads of tab tape and an apparatus for arranging bumps used for the same | Tadakatsu Maruyama, Yasuhide Ohno, Masashi Konda, Tosiharu Kikuchi, Yasuhiro Suzuki +2 more | 1992-05-19 |