Issued Patents All Time
Showing 26–50 of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10844457 | Ferritic stainless steel foil | Hiroto Unno, Naoya SAWAKI, Naoki Fujimoto, Masahiro Fukuda, Toru Inaguma | 2020-11-24 |
| 10840208 | Bonding wire for semiconductor device | Tetsuya OYAMADA, Daizo Oda, Takashi Yamada | 2020-11-17 |
| 10790259 | Cu alloy bonding wire for semiconductor device | Tetsuya OYAMADA, Takashi Yamada, Daizo Oda | 2020-09-29 |
| 10786974 | Stainless steel foil | Hiroto Unno, Naoya SAWAKI, Naoki Fujimoto, Masahiro Fukuda, Toru Inaguma | 2020-09-29 |
| 10789228 | Data presence/absence determination apparatus and computer-readable storage medium storing program for determination of data presence/absence | Takuya Nagao, Takashi Kuwayama, Tomonori Furuta | 2020-09-29 |
| 10771011 | Circuit device, oscillator, electronic apparatus, and vehicle | — | 2020-09-08 |
| 10737356 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Teruo Haibara, Ryo OISHI, Kazuyuki Saito | 2020-08-11 |
| 10672733 | Cu alloy core bonding wire with Pd coating for semiconductor device | Takashi Yamada, Daizo Oda, Teruo Haibara | 2020-06-02 |
| 10610976 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Teruo Haibara, Ryo OISHI, Kazuyuki Saito | 2020-04-07 |
| 10615123 | Three-dimensional memory device containing compositionally graded word line diffusion barrier layer for and methods of forming the same | Tatsuya Hinoue, Tomoyuki Obu, Yusuke Mukae, Rahul Sharangpani, Raghuveer S. Makala +2 more | 2020-04-07 |
| 10529683 | Bonding wire for semiconductor device | Tetsuya OYAMADA, Daizo Oda, Takashi Yamada | 2020-01-07 |
| 10497663 | Cu alloy core bonding wire with Pd coating for semiconductor device | Takashi Yamada, Daizo Oda, Teruo Haibara | 2019-12-03 |
| 10468370 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Ryo OISHI | 2019-11-05 |
| 10414002 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Teruo Haibara, Ryo OISHI, Kazuyuki Saito | 2019-09-17 |
| 10381320 | Silver bonding wire for semiconductor device containing indium, gallium, and/or cadmium | Tetsuya OYAMADA, Hiroyuki Deai, Daizo Oda | 2019-08-13 |
| 10323294 | Austenitic stainless steel foil | Hiroto Unno, Naoya SAWAKI, Naoki Fujimoto, Masahiro Fukuda, Toru Inaguma | 2019-06-18 |
| 10236272 | Cu alloy core bonding wire with Pd coating for semiconductor device | Takashi Yamada, Daizo Oda, Teruo Haibara | 2019-03-19 |
| 10137534 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Teruo Haibara, Ryo OISHI, Kazuyuki Saito | 2018-11-27 |
| 10121758 | Bonding wire for semiconductor device | Daizo Oda, Motoki ETO, Kazuyuki Saito, Teruo Haibara, Ryo OISHI +1 more | 2018-11-06 |
| 10121764 | Method for forming ball in bonding wire | Noritoshi Araki, Takashi Yamada, Teruo Haibara, Ryo OISHI | 2018-11-06 |
| 10121965 | Resistive random access memory device containing discrete memory material portions and method of making thereof | Shiori Kataoka, Yusuke Yoshida | 2018-11-06 |
| 10115899 | Methods and apparatus for three-dimensional nonvolatile memory | Yusuke Yoshida, Tomoyuki Obu, Takeki Ninomiya, Toshihiro Iizuka | 2018-10-30 |
| 10089201 | Storage device, storage system and non-transitory computer-readable storage medium for mirroring of data | Hiroyuki Yamashita, Yasuhito Kikuchi, Yoshimasa MISHUKU | 2018-10-02 |
| 10032741 | Bonding wire for semiconductor device | Daizo Oda, Motoki ETO, Takashi Yamada, Teruo Haibara, Ryo OISHI +1 more | 2018-07-24 |
| 9887172 | Bonding wire for semiconductor device | Daizo Oda, Motoki ETO, Kazuyuki Saito, Teruo Haibara, Ryo OISHI +1 more | 2018-02-06 |