Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8362364 | Wiring board assembly and manufacturing method thereof | Shinnosuke MAEDA | 2013-01-29 |
| 8233289 | Multilayer wiring substrate and method for manufacturing the same | Shinnosuke MAEDA, Takuya HANDO | 2012-07-31 |
| 8153909 | Multilayer wiring board and method of manufacturing the same | Hiroshi Katagiri | 2012-04-10 |
| 8110754 | Multi-layer wiring board and method of manufacturing the same | — | 2012-02-07 |
| 8093503 | Multilayer wiring board | Hiroshi Katagiri | 2012-01-10 |
| 8035035 | Multi-layer wiring board and method of manufacturing the same | — | 2011-10-11 |
| 7977580 | Intermediate multilayer wiring board product, and method for manufacturing multilayer wiring board | Seigo Ueno | 2011-07-12 |
| 7348695 | Linear motor, moving stage system, exposure apparatus, and device manufacturing method | Nobushige Korenaga | 2008-03-25 |
| 7330093 | Alignment apparatus, exposure apparatus, and device manufacturing method | Yugo Shibata | 2008-02-12 |
| 7193493 | Alignment apparatus, exposure apparatus, and device manufacturing method | Yugo Shibata | 2007-03-20 |
| 7067942 | Linear motor, moving stage system, exposure apparatus, and device manufacturing method | Nobushige Korenaga | 2006-06-27 |
| 6867849 | STAGE APPARATUS WHICH SUPPORTS INTERFEROMETER, STAGE POSITION MEASUREMENT METHOD, PROJECTION EXPOSURE APPARATUS, PROJECTION EXPOSURE APPARATUS MAINTENANCE METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICONDUCTOR MANUFACTURING FACTORY | Kazunori Iwamoto | 2005-03-15 |
| 6654098 | Stage apparatus, exposure apparatus, and device production method | Takao Ukaji | 2003-11-25 |
| 6495847 | Stage control apparatus and exposure apparatus | Mitsuru Inoue, Eiji Sakamoto | 2002-12-17 |
| 5684856 | Stage device and pattern transfer system using the same | Hirohito Itoh, Shinji Ohishi, Kazunori Iwamoto, Nobushige Korenaga, Youzou Fukagawa +1 more | 1997-11-04 |
| 5331204 | Integrated circuit package in which impendance between signal pads and signal lines is matched by reducing the size of a ground plane | Masao Kuroda, Ryuji Imai | 1994-07-19 |